ST7265XEVALMS STMicroelectronics, ST7265XEVALMS Datasheet - Page 153

• Manufacturer Part Number: ST7265XEVALMS
• Manufacturer: STMicroelectronics

Specifications of ST7265XEVALMS

• Lead Free Status / Rohs Status: Supplier Unconfirmed

14.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
■
■
Table 38. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
SDIP & PDIP
QFN
LQFP and SO
ECOPACK
to the JEDEC STD-020C compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
.
TM
TM
aspects
(AN2033,
packages are qualified according
transition program is available on
Sn (pure Tin)
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– TQFP, SDIP and SO Pb-packages are compati-
packages are fully compatible with Lead (Pb)
containing soldering process (see application
note AN2034)
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Pb solder paste
Yes
Yes
Yes
TM
LQFP, SDIP, SO and QFN20
Pb-free solder paste
Yes *
Yes *
Yes *
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