JG82855GME S L7VN Intel, JG82855GME S L7VN Datasheet - Page 170

• Manufacturer Part Number: JG82855GME S L7VN
• Manufacturer: Intel

Specifications of JG82855GME S L7VN

• Package Type: FCBGA
• Rad Hardened: No
• Lead Free Status / Rohs Status: Compliant

170
Electrical Characteristics
8.2
Table 44. Intel
NOTES:
Thermal Characteristics
The Intel 855GM/855GME GMCH is designed for operation at die temperatures between 0°C and
105 °C. The thermal resistance of the package is given in Table 44.
NOTE: ** Estimate
VCCAHPLL,
VCCAGPLL,
VCCADPLLA,
VCCADPLLB
Intel 855GME GMCH Only
VCC
VCCHI
VCCASM
(DDR333
SDRAM)
VCCAHPLL,
VCCAGPLL,
VCCADPLLA,
VCCADPLLB
Ψ
Θ
jt
ja
(°C/Watt)**
(°C/Watt)**
Symbol
®
1. Functionality is not guaranteed for parts that exceed Tdie temperature above 105 °C. Full performance
2. Possible damage to the GMCH may occur if the GMCH temperature exceeds 150 °C. Intel does not
Parameter
855GM/855GME GMCH Package Thermal Resistance
may be affected if the on-die thermal sensor is enabled. Please refer to the Intel®
852GM/855GM/855GME Chipset Mobile Thermal Design Guide for supplementary details.
guarantee functionality for parts that have exceeded temperatures above 150 °C due to spec
violation.
Power supply for the Host PLL, Power Supply for the
Hub PLL, Power supply for the Display PLL A, Power
supply for the Display PLL B, respectively
1.35 V Core Supply Voltage with respect to VSS
1.35 V Hub Interface Supply Voltage with respect to
VSS
1.35 V DDR SDRAM System Memory Logic Supply
Voltage (not connected to Core) with respect to VSS
Power supply for the Host PLL, Power Supply for the
Hub PLL, Power supply for the Display PLL A, Power
supply for the Display PLL B, respectively
0 m/s
20.0
Airflow Velocity in Meters/Second
0.5
Parameter
1 m/s
17.3
1.8
Min
-0.3
-0.3
-0.3
-0.3
-0.3
Max
1.65
1.65
1.65
1.65
1.65
Unit
Datasheet
V
V
V
V
V
Notes
R