8080-1G7 TE Connectivity, 8080-1G7 Datasheet - Page 8

TRANSISTOR SOCKET, 3POS, THROUGH HOLE

8080-1G7

Manufacturer Part Number
8080-1G7
Description
TRANSISTOR SOCKET, 3POS, THROUGH HOLE
Manufacturer
TE Connectivity
Datasheet

Specifications of 8080-1G7

Connector Type
TO-3 Socket
No. Of Contacts
3
Pitch Spacing
5.46mm
Contact Termination
Solder
Contact Material
Beryllium Copper
Contact Plating
Gold
Socket Mounting
PC Board
Rohs Compliant
No
Product Type
Socket
Terminal Configuration
Contact
Product Series
8080-1G Series
Package
TO-3
Number Of Solder Lugs
2
Terminal Plating
Gold
Terminal Style
Solder
Number Of Terminals
3
Socket Type
Transistor
Terminal Material
Beryllium Copper
Insulator Material
Phenolic
Lead Size Accepted (mm [in])
1.02 [0.040]
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Operating Temperature (°c)
-55 – +125
5008
FEATURES:
The 500 Series Socket features a precision four-finger inner contact to
produce the industry standard for high reliability screw machine sockets.
• Precision four-finger inner contact provides concentric funnel entry for
• Machined (Premium Series) and stamped (Economy Series) contacts
• "X" & "Y" stackable
• Non-wicking, closed bottom sleeve gives 100% protection against flux
• Accommodates 6 through 40 pin DIPS, rectangular or round leads
• Beryllium copper inner contact for maximum mechanical and
• For extreme conditions involving shock and vibration, The AMP high
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• PCB Hole Size Range:
• IC Pin Dimension Range: .009" x .015" (0,23 x 0,38) through
MATERIAL SPECIFICATIONS:
Insulator............................Thermoplastic polyester, UL rated 94V-0
Sleeve ..............................Machined brass/formed copper
Contact ............................Beryllium copper
Sleeve Plating ..................Tin/lead or gold
Contact Plating ................Premium or Economy Series (ES) - gold or
500 Series
Products for Industrial &
Commercial Applications
easy flat and round lead insertion
are available
and solder contamination. Choice of solderless wrap or PC termination
Laboratories, Inc. file no. E111362
electrical performance
retention series is available
®
Recognized under the Component Program of Underwriters
Economy Series (ESL) - low gold
tin/lead
.035" ± .002" (0,89 ± 0,05) PC tail,
.055" ± .003" (1,40 ± 0,08) solderless wrap
.011" x .020" (0,28 x 0,51)
.016" to .021" (0,41 to 0,53) round lead,
.105" (2,67) min. length
Dimensions are shown for
reference purposes only.
528-AG11D-ES
DIP Sockets
Four-Fingered Contact & Solid Insulator
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ..........................Passed MIL-STD-1344, Method 2005.1,
Shock................................Passed MIL-STD-1344, Method 2004.1,
Durability ........................Passed MIL-STD-1344, Method 2016
Normal Force ..................125 Grams (4.4 oz.) average with .018" (0,46) dia.
Inner Contact Retention ..
Sleeve Retention
Solderability ....................Passed MIL-STD-202F, Method 208
Insertion Force ................Premium - 134 Grams (4.7 oz.) average with a
Withdrawal Force ............63 Grams (2.2 oz.) average with a .018" (0,46)
(Premium and Economy)
ELECTRICAL
Contact Resistance ..........10 Milliohms max.
Contact Rating..................3 Amps
Capacitance ....................1.0 pF per MIL-STD-202, Method 305
Insulation Resistance........5,000 Megohms min. @ 500 VDC per
Dielectric Withstanding
ENVIRONMENTAL
Humidity ..........................Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock ................Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature ....Gold inner contact -55°C to +125°C,
in Sleeve ........................7.5 Lbs. per line average
in Plastic........................3.0 Lbs. per line minimum
Voltage ........................1,000 Volts RMS per MIL-STD-1344,
(contact to contact)
Low profile
“X” & “Y”
stackable
insulator
Specifications subject to
change.
or PC termination
Solderless wrap
200 Grams (7.1 oz.) average with .018" (0,46) dia.
Economy - 179 Grams (6.3 oz.) average with a
Tin/lead inner contact -55°C to +105°C
Condition II, 10 G’s
Condition C, 100 G’s
polished steel pin (Premium Series)
polished steel pin (Economy Series)
.018" (0,46) dia. polished steel pin
.018" (0,46) dia. polished steel pin
dia. polished steel pin
MIL-STD-1344, Method 3003.1
Method 3001.1
Wide tapered entry
Technical Support Center
1-800-522-6752
www.tycoelectronics.com
Non-wicking
closed bottom
Catalog 1307612
Precision
four-finger
inner contact
Revised 7-01

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