8080-1G7 TE Connectivity, 8080-1G7 Datasheet - Page 33

• Manufacturer Part Number: 8080-1G7
• Description: TRANSISTOR SOCKET, 3POS, THROUGH HOLE
• Manufacturer: TE Connectivity

Specifications of 8080-1G7

• Connector Type: TO-3 Socket
• No. Of Contacts: 3
• Pitch Spacing: 5.46mm
• Contact Termination: Solder
• Contact Material: Beryllium Copper
• Contact Plating: Gold
• Socket Mounting: PC Board
• Rohs Compliant: No
• Product Type: Socket
• Terminal Configuration: Contact
• Product Series: 8080-1G Series
• Package: TO-3
• Number Of Solder Lugs: 2
• Terminal Plating: Gold
• Terminal Style: Solder
• Number Of Terminals: 3
• Socket Type: Transistor
• Terminal Material: Beryllium Copper
• Insulator Material: Phenolic
• Lead Size Accepted (mm [in]): 1.02 [0.040]
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Operating Temperature (°c): -55 – +125

Product Facts
Products for Industrial &
Commercial Applications
Low profile — only 4.6
[.181] max.* for high
density pc board stacking
Compatible footprint allows
for socket or direct
mounting
Housing slots accept
extraction tool for easy
PLCC removal
Corner chamfer for PLCC
orientation
Available loose piece or
tape mounted
Plastic standoffs provide
clearance for heat
dissipation and cleaning
operations
Housings will withstand
high temperature soldering
Open bottom housing for
convenient placement of
socket on pattern, 100%
inspection of solder joint,
and penetration of heat
source to the solder pad and
surface mount contact
Top contact slots allow test
probing with PLCC device in
place
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by
Canadian Standards
Association
File LR 7189A-97
®
Dimensions are shown for
reference purposes only.
®
The AMP family of Low
Profile Plastic Leaded Chip
Carrier (PLCC) Sockets for
surface mounting is
designed to accommodate
Plastic “J” leaded, tin plated
devices made to JEDEC
Specifications MS-018
(square packages) and MS-
016-AE (rectangular
packages).
Available in 20, 28, 32, 44,
52, 68 and 84 positions,
these sockets feature high
normal force contacts made
from phosphor bronze
material with tin-lead over
nickel plating. Sockets
feature a one-piece housing
that will withstand vapor-
phase, I.R. or convection
reflow soldering
temperatures and prevent
flux and solvent entrapment.
PLCC Sockets
For complete product information, order Catalog 1307767
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
The low profile housing is
only 4.6 [.181] high, maxi-
mum* allowing high density
printed circuit board
stacking. The open bottom
design enables easy socket
placement on the pc board
footprint pattern facilitates
inspection as well as
permitting the heat source
to penetrate to the solder
pad and surface mount
contact. The socket uses
the same footprint pattern
as the chip carrier.
Sockets are also available
on embossed tape made to
EIA Standard 481 which
allows interchangeability
of tape in commercially
available pick-and-place
equipment.
Specifications subject to
change.
Dimensions are
millimeters over inches
METRIC
Technical Support Center
1-800-522-6752
www.tycoelectronics.com
Catalog 1307612
Revised 7-01
5033
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