8080-1G7 TE Connectivity, 8080-1G7 Datasheet - Page 2

• Manufacturer Part Number: 8080-1G7
• Description: TRANSISTOR SOCKET, 3POS, THROUGH HOLE
• Manufacturer: TE Connectivity

Specifications of 8080-1G7

• Connector Type: TO-3 Socket
• No. Of Contacts: 3
• Pitch Spacing: 5.46mm
• Contact Termination: Solder
• Contact Material: Beryllium Copper
• Contact Plating: Gold
• Socket Mounting: PC Board
• Rohs Compliant: No
• Product Type: Socket
• Terminal Configuration: Contact
• Product Series: 8080-1G Series
• Package: TO-3
• Number Of Solder Lugs: 2
• Terminal Plating: Gold
• Terminal Style: Solder
• Number Of Terminals: 3
• Socket Type: Transistor
• Terminal Material: Beryllium Copper
• Insulator Material: Phenolic
• Lead Size Accepted (mm [in]): 1.02 [0.040]
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Operating Temperature (°c): -55 – +125

5002
Product Facts
Products for Industrial &
Commercial Applications
Dual wiping contacts
Face wipe contacts for high
reliability and constant,
low resistance
Anti-overstress prevents
contact damage
Visual polarization
Designed for automatic
machine insertion —
DIP-to-socket or
socket-to-board (tube
loaded)
Large target area with
tapered lead-in ramps for
easy DIP insertion
Stackable end-to-end and
side-to-side (brickwalling)
for high board density
Housing standoffs and slots
facilitate board cleaning
Family of 6 through 48
positions
Retention-style tails or
straight solder tails
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
Certified by
Canadian Standards
Association
R
Dimensions are shown for
reference purposes only.
R
The Dual Leaf (DL) DIP
socket family provides high
quality at low cost with
superior handling
characteristics. Sockets are
available in 6- through 48-
position sizes with dual
wiping contacts. The large
target area of the contacts
and tapered side ramps in
the housing promote easy
entry of a DIP package.
Internal anti-overstress
walls on standard versions
prevent contact damage.
The housings are compati-
ble with commercially
available automatic insertion
equipment for socket-to-
board or DIP-to-socket
applications.
DIP Sockets
Solder Tail Dual Leaf (DL) Contact
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Standoffs provide board
clearance for proper
cleaning after soldering.
Sockets are available with
straight solder tails for
clinching and are “true
positioned” for automatic
insertion into the pc board.
Specifications subject to
change.
Performance Characteristics:
Rating — Signal application only
Contact Resistance — 20 milliohms
max. (initial)
30 milliohms max. (after test)
Dielectric Withstanding Voltage —
1000 VRMS min.
Insulation Resistance — 10,000
megohms min. (initial)
Capacitance — 0.5 picofarad max.
Operating Temperature —
-40°C to +105°C (tin)
-55°C to +125°C (gold)
Vibration — 15 Gs, 10-2000 Hz with
100 ma current
Shock — 100 Gs sawtooth, 6 shocks
Engaging Force — 340 grams max.
(initial)
Separating Force — 25 grams min.
per Tyco Electronics Specification
108-1066 (Standard)
Technical Support Center
1-800-522-6752
www.tycoelectronics.com
Catalog 1307612
Revised 7-01