8080-1G7 TE Connectivity, 8080-1G7 Datasheet - Page 32

• Manufacturer Part Number: 8080-1G7
• Description: TRANSISTOR SOCKET, 3POS, THROUGH HOLE
• Manufacturer: TE Connectivity

Specifications of 8080-1G7

• Connector Type: TO-3 Socket
• No. Of Contacts: 3
• Pitch Spacing: 5.46mm
• Contact Termination: Solder
• Contact Material: Beryllium Copper
• Contact Plating: Gold
• Socket Mounting: PC Board
• Rohs Compliant: No
• Product Type: Socket
• Terminal Configuration: Contact
• Product Series: 8080-1G Series
• Package: TO-3
• Number Of Solder Lugs: 2
• Terminal Plating: Gold
• Terminal Style: Solder
• Number Of Terminals: 3
• Socket Type: Transistor
• Terminal Material: Beryllium Copper
• Insulator Material: Phenolic
• Lead Size Accepted (mm [in]): 1.02 [0.040]
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Operating Temperature (°c): -55 – +125

5032
Product Facts
Material and Finish:
Housing and Ejector — High
Temperature Nylon
Contact — Phosphor Bronze
Contact area — .000003 [0.000076]
min. thick gold flash over .000020
[0.00051] min. thick palladium nickel
over .000050 [0.00127] min. thick nickel
Solder tail — .000150 [0.0038] min.
thick tin lead over .000025 [0.00064]
min. thick nickel
Technical Documents:
Product Specification
108-1801
Application Specification
114-1118
For complete product information,
order Catalog 1307767
Products for Industrial &
Commercial Applications
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File E28476
Certified by Canadian
Standards
Association
File No. LR 7189
Low profile design
Metal board hold-downs
Accommodates EDO DRAM
and SDRAM modules
3.3 volts
Applicable to PC-100 &
PC-133 modules
®
®
Dimensions are shown for
reference purposes only.
These 168 position sockets
are designed to connect
EDO DRAM and SDRAM
modules to the
motherboard. The connector
allows the module to be
For vertical DIMM IIP sockets, see page 5029.
(non-buffered)
DIMM IIP Sockets
25° Angular
(buffered)
Standard
DRAM
DRAM
DRAM
DRAM
Type
Sync
NB
Length
(Dim.
2.62
.103
3.18
.125
2.62
.103
3.18
.125
2.62
.103
3.18
.125
Tail
A)
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Center Plastic
390170-4
390185-4
390170-5
390185-5
390170-6
390185-6
slanted at 25° from the
motherboard, thereby
lowering the total vertical
dimension. Plastic
alignment posts allow for
easy insertion and
Post
Part Numbers
140.97
[5.550]
140.97
[5.550]
Specifications subject to
change.
Center Metal
Board Lock
125.07
[4.924]
[4.924]
390195-4
390195-5
390195-6
125.07
—
—
—
Dimensions are
millimeters over inches
METRIC
improved stability during
module insertion, while
metal hold-downs eliminate
bowing. Positive locking
extractors accommodate
larger modules.
Dim. A
Dim. A
Technical Support Center
1-800-522-6752
www.tycoelectronics.com
Catalog 1307612
14.80
[.583]
14.80
[.583]
Photo #112008
Revised 7-01