8080-1G7 TE Connectivity, 8080-1G7 Datasheet - Page 26

TRANSISTOR SOCKET, 3POS, THROUGH HOLE

8080-1G7

Manufacturer Part Number
8080-1G7
Description
TRANSISTOR SOCKET, 3POS, THROUGH HOLE
Manufacturer
TE Connectivity
Datasheet

Specifications of 8080-1G7

Connector Type
TO-3 Socket
No. Of Contacts
3
Pitch Spacing
5.46mm
Contact Termination
Solder
Contact Material
Beryllium Copper
Contact Plating
Gold
Socket Mounting
PC Board
Rohs Compliant
No
Product Type
Socket
Terminal Configuration
Contact
Product Series
8080-1G Series
Package
TO-3
Number Of Solder Lugs
2
Terminal Plating
Gold
Terminal Style
Solder
Number Of Terminals
3
Socket Type
Transistor
Terminal Material
Beryllium Copper
Insulator Material
Phenolic
Lead Size Accepted (mm [in])
1.02 [0.040]
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Operating Temperature (°c)
-55 – +125
5026
Product Facts
Products for Industrial &
Commercial Applications
Sockets Dual Read-Out
SDRAM and SGRAM
Cam-in module loading
provides easy insertion
Positive wipe on pads
during module insertion
Contact performance in
excess of 100 MHz
Increased lead-in geometry
reduces insertion force
Module stabilization
features
Dimensions are shown for
reference purposes only.
SO DIMM sockets are
available in a 144-position
dual read-out version for
SDRAM (Synchronous
Dynamic Random Access
Memory) and a version for
SGRAM (Synchronous
Graphic Random Access
Memory).
For use in Frame Buffer
Memory applications, where
height off the board is
important, this socket is
ideal because of its right
angle, low vertical height
design.
Sockets use 0.8mm
centerline technology to
provide more than triple the
density of standard SIMM
sockets and provide highly
SO DIMM Sockets
Dual Read-Out Sockets for SDRAM and SGRAM
For complete product information, order Catalog 1307767
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
reliable, low cost, space
saving benefits. Easy
aligning, cam-in module
loading and dual locking
levers provide for simple
do-it-yourself upgrades.
The SDRAM version is
available in four card slot
heights of 2.1mm [.083 in.],
3.3mm [.130 in.], 3.7mm
[.146 in.] and 8.0mm [.315]
for 3.3V power supplies.
The SGRAM version is
available in two card slot
heights; 3.7mm [.146] and
8.0 [.315] for 3.3V power
supplies. Hard tray and
tape-and-reel packaging
are available for automatic
placement. Contact Tyco
Electronics for part number
availability.
Specifications subject to
change.
Dimensions are
millimeters over inches
METRIC
Performance Characteristics:
Operating Temperature —
-55°C to +105°C
Termination Resistance
(Dry Circuit) — 30 milliohms max.,
initial ∆R=20 milliohms max., final
Dielectric Strength — 1.0 KVAC
Insulation Resistance — 10,000
megohms min.
Durability — 25 cycles
PCB Mating Force — 59.8 N
[13.44 lb] max., initial
Technical Documents:
Product Specification
108-1739
Technical Support Center
1-800-522-6752
www.tycoelectronics.com
Catalog 1307612
Revised 7-01

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