8080-1G7 TE Connectivity, 8080-1G7 Datasheet - Page 24

• Manufacturer Part Number: 8080-1G7
• Description: TRANSISTOR SOCKET, 3POS, THROUGH HOLE
• Manufacturer: TE Connectivity

Specifications of 8080-1G7

• Connector Type: TO-3 Socket
• No. Of Contacts: 3
• Pitch Spacing: 5.46mm
• Contact Termination: Solder
• Contact Material: Beryllium Copper
• Contact Plating: Gold
• Socket Mounting: PC Board
• Rohs Compliant: No
• Product Type: Socket
• Terminal Configuration: Contact
• Product Series: 8080-1G Series
• Package: TO-3
• Number Of Solder Lugs: 2
• Terminal Plating: Gold
• Terminal Style: Solder
• Number Of Terminals: 3
• Socket Type: Transistor
• Terminal Material: Beryllium Copper
• Insulator Material: Phenolic
• Lead Size Accepted (mm [in]): 1.02 [0.040]
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Operating Temperature (°c): -55 – +125

5024
Product Facts
Products for Industrial &
Commercial Applications
Accepts module boards in a
thickness range of
.047-.054 [1.19-1.37] to
allow the use of JEDEC
standard boards
Polarized posts on socket
provide a means of properly
orienting the socket on the
pc board
Pin 1 indicator in the socket
orients the module board to
the socket
.050 [1.27] centerline
sockets offer three
profile heights — .125
[3.18], .160 [4.06] and
.250 [6.35] to allow the use
of single- and dual-sided
boards, and the placement
of components beneath the
module board if required
Very low insertion force for
easy module insertion
Metal latches provide
superior strength
Center post on .050 [1.27]
product provides retention
in the pc board through
the soldering process
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File E28476
Certified by
Canadian Standards
Association
File No. LR 7189
®
®
Dimensions are shown for
reference purposes only.
Tyco Electronics developed
the SIMM II Right Angle
Sockets for interfacing
Single In-Line Memory
Module (SIMM) boards
horizontally to the pc board
while using a traditional
cam-in approach. Available
in .050 [1.27] centerline with
gold and tin plating options,
the sockets are designed to
accept the JEDEC standard
pc board thickness range of
.047-.054 [1.19-1.37].
In order to allow for many
different customer designs,
the .050 [1.27] centerline
sockets are available in
three card slot heights —
.125 [3.18], .160 [4.06] and
.250 [6.35]. This multi-height
capability allows customers
to use single- or dual-sided
module boards while
providing the lowest overall
height for packaging. The
.125 [3.18] height version
provides an extremely low
profile interface while
maintaining easy insertion
and extraction within
SIMM II Right Angle Sockets
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
restricted packaging
specifications.
A very low insertion force is
required to install the module
board. To install, simply
angle the module into the
socket card slot, then pivot
the module board into
position where it is secured
by the locking latches.
The housing is made from
liquid crystal polymer (LCP),
assuring strong durable
ramps. The latches for the
.125 [3.18] height versions
are made from LCP while all
other versions have metal
latches. Polarizing posts
coincide with mounting holes
in the pc board to prevent
misinsertion.
Specifications subject to
change.
Performance Characteristics:
Current Rating — 1 ampere max.
Termination Resistance
(Dry Circuit) — 20 milliohms max.
(initial)
Dielectric Withstanding Voltage —
1 KVAC
Insulation Resistance — 10,000
megohms min. (initial)
Operating Temperature —
-55°C to +85°C continuous, +105°C
peak
Durability — 25 cycles min.
Technical Documents:
Product Specification
108-1297
Application Specification
114-1060
Technical Support Center
1-800-522-6752
www.tycoelectronics.com
Catalog 1307612
Revised 7-01