8080-1G7 TE Connectivity, 8080-1G7 Datasheet - Page 39

• Manufacturer Part Number: 8080-1G7
• Description: TRANSISTOR SOCKET, 3POS, THROUGH HOLE
• Manufacturer: TE Connectivity

Specifications of 8080-1G7

• Connector Type: TO-3 Socket
• No. Of Contacts: 3
• Pitch Spacing: 5.46mm
• Contact Termination: Solder
• Contact Material: Beryllium Copper
• Contact Plating: Gold
• Socket Mounting: PC Board
• Rohs Compliant: No
• Product Type: Socket
• Terminal Configuration: Contact
• Product Series: 8080-1G Series
• Package: TO-3
• Number Of Solder Lugs: 2
• Terminal Plating: Gold
• Terminal Style: Solder
• Number Of Terminals: 3
• Socket Type: Transistor
• Terminal Material: Beryllium Copper
• Insulator Material: Phenolic
• Lead Size Accepted (mm [in]): 1.02 [0.040]
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Operating Temperature (°c): -55 – +125

Product Facts
Products for Industrial &
Commercial Applications
.025 [0.64] centerline for
high density, low cost
packaging
Low profile permits even
higher density packaging
with only .375 [9.53]
maximum height pc boards
High normal force and
positive engagement
allows for reliable service
to minimize field failures
Protective cover separates
and safeguards IC leads
during handling and
insertion
Closed-bottom housing aids
in prevention of solder
bridging between contacts
Contacts absorb mating and
reaction forces for board
and housing protection
Economical design makes
socketing of semi-conductor
devices more attractive
.020 [0.51] minimum wipe
contact insures reliability of
tin-to-tin interface
Sockets can be spaced a
minimum of .150 [3.81]
from each other
High temperature materials
Dimensions are shown for
reference purposes only.
The two-piece design of the
AMP socket eases the
problems of handling the
gullwing-leaded PQFP
packages. The IC is first
inserted into the plastic
cover and then, using the
insertion tool, the cover is
secured over the socket
housing to insert the chip
into the socket. The
completed assembly
presents a low .375 [9.53]
profile to permit close
stacking of pc boards.
The cover, which is sepa-
rately available, contains
slots that not only protect
and separate the leads, but
also for proper lead-to-
contact registration
between chip and socket.
In addition, the cover
provides a rugged cost-
effective method of
protecting the PQFP IC
during shipping, handling
and assembly. Visual and
mechanical polarization for
proper orientation of cover
and housing during mating,
PQFP Sockets
Standard
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
while spring latches in the
four corners secure the
cover to the housing.
Tin plated socket contacts
provide a minimum .020
[0.51] wipe and exert a
high normal force to the IC
leads. The solder legs are
arranged on a .075 x .100
[1.91 x 2.54] three-row grid
to permit easy trace routing.
High-temperature housing
materials and a sealed
bottom allow the socket to
withstand the rigors of flow
soldering lines and other
automated assembly.
Standoffs ease flux
cleaning.
Available in 100- and 132-
position sizes, the socket
features short leads and low
capacitance, making it
highly compatible with high-
speed circuits.
Specifications subject to
change.
Performance Characteristics:
Current Rating — 1 ampere max.
Operating Temperature —
+55°C to +105°C
Dielectric Withstanding Voltage —
750 VAC min.
Capacitance (Adjacent Contacts) —
1 picofarad max.
Durability — 15 insertion/withdrawal
cycles
Technical Documents:
Product Specification
108-1223
Application Specification
114-1070
Test Report
501-90
Instruction Sheets
408-3289 Hand Tools
408-9772 Pneumatic Tools
Technical Support Center
1-800-522-6752
www.tycoelectronics.com
Catalog 1307612
Revised 7-01
5039
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