8080-1G7 TE Connectivity, 8080-1G7 Datasheet - Page 63

TRANSISTOR SOCKET, 3POS, THROUGH HOLE

8080-1G7

Manufacturer Part Number
8080-1G7
Description
TRANSISTOR SOCKET, 3POS, THROUGH HOLE
Manufacturer
TE Connectivity
Datasheet

Specifications of 8080-1G7

Connector Type
TO-3 Socket
No. Of Contacts
3
Pitch Spacing
5.46mm
Contact Termination
Solder
Contact Material
Beryllium Copper
Contact Plating
Gold
Socket Mounting
PC Board
Rohs Compliant
No
Product Type
Socket
Terminal Configuration
Contact
Product Series
8080-1G Series
Package
TO-3
Number Of Solder Lugs
2
Terminal Plating
Gold
Terminal Style
Solder
Number Of Terminals
3
Socket Type
Transistor
Terminal Material
Beryllium Copper
Insulator Material
Phenolic
Lead Size Accepted (mm [in])
1.02 [0.040]
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
Operating Temperature (°c)
-55 – +125
FEATURES:
AMP offers a SIP style socket for use with PC fuses
• Precision four-finger inner contact provides concentric funnel entry for
• Non-wicking, closed bottom sleeve gives 100% protection against flux
• BeCu inner contact for maximum mechanical and
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• PCB Hole Size Range:
• IC Pin Dimension Range: .009" x .015" (0,23 x 0,38) through
MATERIAL SPECIFICATIONS:
Insulator............................Thermoplastic polyester, UL rated 94V-0
Inner Contact....................Four-fingered beryllium copper,
Outer Sleeve ....................Machined brass, gold over nickel or
PART NUMBER
500 Series
Note: Before ordering, see Cross Reference in Section 15 for
equivalent Tyco Electronics Part Number.
Products for Industrial &
Commercial Applications
easy flat and round lead insertion
and solder contamination
electrical performance
Part Number
510-21114
510-21232
510-21232
Contact Plating
Tin/Lead
gold over nickel plated
tin/lead over copper plated
Gold
.035" ± .003" (0,89 ± 0,08) PC tail
.016" to .021" (0,41 to 0,53) round lead,
Dimensions are shown for
reference purposes only.
.011" x .020" (0,28 x 0,51)
.105"(2,67) min. length
Specialty Sockets
Fuse Sockets
Sleeve Plating
Tin/Lead
Tin/Lead
.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
(3,18
.125
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ..........................Passed MIL-STD-1344, Method 2005.1,
Shock................................Passed MIL-STD-1344, Method 2004.1,
Durability ........................Passed MIL-STD-1344, Method 2016
Normal Force ..................200 Grams (7.1 oz.) average with .018" (0,46)
Inner Contact
Sleeve Retention
Solderability ....................Passed MIL-STD-202F, Method 208
Insertion Force ................179 Grams (6.3 oz.) average with a .018" (0,46)
Withdrawal Force ............63 Grams (2.2 oz.) average with a .018" (0,46)
ELECTRICAL
Contact Resistance ..........10 Milliohms max.
Contact Rating..................3 Amps
Capacitance ....................1.0 pF per MIL-STD-202, Method 305
Insulation Resistance........5,000 Megohms min. @ 500 VDC per
Dielectric Withstanding
ENVIRONMENTAL
Humidity ..........................Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock ................Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature ....Gold inner contact -55°C to +125°C
Retention ......................7.5 Lbs. per line average
in Plastic........................3.0 Lbs. per line minimum
(2,54)
Voltage ........................1,000 Volts RMS per MIL-STD-1344,
.100
(contact to contact)
.015
0,38)
BLANK
Dia. Ref.
(7,62)
.300
(0,51)
Specifications subject to
change.
.020
Typ.
Contacts on
Tin/lead inner contact -55°C to +105°C
centers
(4,57)
(2,54)
Max.
.180
.100
Condition II, 10 G’s
Condition C, 100 G’s
dia. polished steel pin
dia. polished steel pin
dia. polished steel pin
MIL-STD-1344, Method 3003.1
Method 3001.1
Technical Support Center
1-800-522-6752
www.tycoelectronics.com
Catalog 1307612
Revised 7-01
5063
5

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