CYII5SC1300AB-QWC Cypress Semiconductor Corp, CYII5SC1300AB-QWC Datasheet - Page 31

• Manufacturer Part Number: CYII5SC1300AB-QWC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CYII5SC1300AB-QWC

• Lead Free Status / RoHS Status: Not Compliant

Table 27. Side View Dimensions (refer to
on page 30).
Document #: 38-05710 Rev. *G
Die (with Pin 1
to the left
center, Top
View)
Pixel (0,0) is
bottom left
Glass Lid
Specifications
Mechanical
Shock
Vibration
Mounting
Profile
Dimension
Parameters
G
A
B
C
D
E
H
F
J
Glass (thickness) - mono
Cavity (depth)
Die - Si (thickness) - mono
Bottom layer (thickness)
Die attach-bondline (thickness)
Glass attach-bondline (thickness)
Imager to lid-outer surface
Imager to lid-inner surface
Imager to seating plane of package
Die thickness
Die center, X offset to the center of package
Die center, Y offset to the center of the package
Die position, X tilt to the Die Attach Plane
Die position, Y tilt to the Die Attach Plane
Die placement accuracy (referenced to die scribe and lead
fingers on package on all four sides)
Die rotation accuracy
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the glass lid
XY size
Thickness
Spectral range for optical coating of window
Reflection coefficient for window (refer to
JESD22-B104C; Condition G
JESD22-B103B; Condition 1
Reflow profile according to J-STD-020D.1
Description
Description
Figure
Figure 30. Side View Dimensions
30) and Mechanical Specifications (refer
Figure
31)
0.500
1.520
0.030
0.030
1.270
Min
0.550
1.750
0.740
0.500
0.060
0.070
1.570
0.950
1.300
(mm)
Typ
Min
N/A
N/A
400
-50
-50
-50
NA
0.5
20
-1
0.600
1.980
0.090
0.110
1.330
Max
to“Package Drawing with Glass”
15 x 15
0.740
1.26
1.69
0.55
<0.8
Typ
0
0
1
1
0
CYII5SM1300AB
2000
1000
2000
Max
N/A
N/A
260
NA
0.6
50
50
50
1
Page 31 of 34
Units
deg
mm
deg
deg
mm
mm
mm
mm
µm
µm
µm
nm
Hz
°C
%
G