CYII5SC1300AB-QWC Cypress Semiconductor Corp, CYII5SC1300AB-QWC Datasheet - Page 29

• Manufacturer Part Number: CYII5SC1300AB-QWC
• Manufacturer: Cypress Semiconductor Corp

Specifications of CYII5SC1300AB-QWC

• Lead Free Status / RoHS Status: Not Compliant

CYII5SM1300AB
Pad position and Packaging
Bare Die
The IBIS5-B-1300 image sensor has 84 pins, 21 pins on every edge. The die size from pad-edge to pad-edge (without scribe-line) is:
10156.5 µm (x) by 9297.25 µm (y). Scribe lines take about 100 to 150 µm extra on each side. Pin 1 is located in the middle of the left
side, indicated by a ‘1’ on the layout. A logo and some identification tags are on the top right of the die.
Figure 29. IBIS5-B-1300 Bare Die Dimensions (All dimensions in µm)
Test structure
Identification
Document #: 38-05710 Rev. *G
Page 29 of 34