NDT456P Fairchild Semiconductor, NDT456P Datasheet - Page 6

• Manufacturer Part Number: NDT456P
• Description: MOSFET P-CH 30V 7.5A SOT-223-4
• Manufacturer: Fairchild Semiconductor

Specifications of NDT456P

• Fet Type: MOSFET P-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 30 mOhm @ 7.5A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 7.5A
• Vgs(th) (max) @ Id: 3V @ 250µA
• Gate Charge (qg) @ Vgs: 67nC @ 10V
• Input Capacitance (ciss) @ Vds: 1440pF @ 15V
• Power - Max: 1.1W
• Mounting Type: Surface Mount
• Package / Case: SOT-223 (3 leads + Tab), SC-73, TO-261
• Configuration: Single Dual Drain
• Transistor Polarity: P-Channel
• Resistance Drain-source Rds (on): 0.03 Ohm @ 10 V
• Forward Transconductance Gfs (max / Min): 13 S
• Drain-source Breakdown Voltage: 30 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: 7.5 A
• Power Dissipation: 3000 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• Continuous Drain Current Id: 7.3A
• Drain Source Voltage Vds: 30V
• On Resistance Rds(on): 35mohm
• Rds(on) Test Voltage Vgs: -10V
• Threshold Voltage Vgs Typ: 1.5V
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NDT456PTR

Typical Thermal Characteristics
0 .0 0 5
0 .0 0 2
0 .0 0 1
Figure 13. Transconductance Variation with Drain
10
0 .05
0 .02
0 .01
Figure 15. Maximum Steady-State Drain
8
6
4
2
0
0 .5
0 .2
0 .1
18
15
12
0 .0 0 0 1
0
9
6
3
0
1
1c
0
V
1b
DS
Current and Temperature.
Current versus Copper Mounting Pad
Area.
D = 0.5
= -5V
0 .2
0 .0 5
0 .0 2
0 .0 1
0 .1
Single Pulse
0.2
2oz COPPER MOUNTING PAD AREA (in )
-2
0 .0 0 1
I , DRAIN CURRENT (A)
T = -55°C
D
0.4
J
-4
Figure 17. Transient Thermal Response Curve
Note: Thermal characterization performed using the conditions described in note 1c. Transient thermal
response will change depending on the circuit board design.
0.6
25°C
-6
0 .01
4.5"x5" FR-4 Board
T = 25 C
Still Air
V
GS
A
= -10V
2
0.8
125°C
o
-8
1a
1
-10
0 .1
t , TIM E (sec)
1
0.03
0.01
0.3
0.1
Figure 16. Maximum Safe Operating Area.
40
20
10
Figure 14. SOT-223 Maximum Steady-State Power
3
1
0.1
3 .5
2 .5
1 .5
0 .5
3
2
1
R
0
SINGLE PULSE
JA
Dissipation versus Copper Mounting Pad
Area.
1c
V
0.2
T
1 b
GS
= See Note 1c
A
= 25°C
= -10V
1
- V
.
0 .2
0.5
2 o z COPPER M O U N T ING PAD AREA (in
DS
, DRAIN-SOURCE VOLTAGE (V)
1
0 .4
2
P(p k)
10
T - T
R
Duty Cycle, D = t
J
R
5
JA
0 .6
JA
t
1
A
(t) = r(t) * R
t
= P * R
= See Note 1 c
2
10
4.5"x5" FR-4 Board
T
Still Air
A
= 25 C
2
0 .8
JA
1
)
o
/ t
1 0 0
(t)
JA
30
2
NDT456P Rev. F
50
1a
3 0 0
1