HUFA76504DK8T Fairchild Semiconductor, HUFA76504DK8T Datasheet - Page 8

• Manufacturer Part Number: HUFA76504DK8T
• Description: MOSFET N-CHAN 80V 2.3A 8-SOIC
• Manufacturer: Fairchild Semiconductor
• Series: UltraFET™r

Specifications of HUFA76504DK8T

• Fet Type: 2 N-Channel (Dual)
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 200 mOhm @ 2.5A, 10V
• Drain To Source Voltage (vdss): 80V
• Current - Continuous Drain (id) @ 25° C: 2.3A
• Vgs(th) (max) @ Id: 3V @ 250µA
• Gate Charge (qg) @ Vgs: 10nC @ 10V
• Input Capacitance (ciss) @ Vds: 270pF @ 25V
• Power - Max: 2.5W
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Configuration: Dual Dual Drain
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 0.173 Ohms
• Forward Transconductance Gfs (max / Min): 0.00008 S
• Drain-source Breakdown Voltage: 80 V
• Gate-source Breakdown Voltage: +/- 16 V
• Continuous Drain Current: 2.3 A
• Power Dissipation: 2.5 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The transient thermal impedance (Z
varied top copper board area. Figure 24 shows the effect of
copper pad area on single pulse transient thermal
impedance. Each trace represents a copper pad area in
square inches corresponding to the descending list in the
graph. Spice and SABER thermal models are provided for
each of the listed pad areas.
©2001 Fairchild Semiconductor Corporation
160
120
80
40
0
10
-1
COPPER BOARD AREA - DESCENDING ORDER
0.020 in
0.140 in
0.257 in
0.380 in
0.493 in
2
2
2
2
2
FIGURE 24. THERMAL RESISTANCE vs MOUNTING PAD AREA
JA
) is also effected by
10
0
t, RECTANGULAR PULSE DURATION (s)
10
Copper pad area has no perceivable effect on transient
thermal impedance for pulse widths less than 100ms. For
pulse widths less than 100ms the transient thermal
impedance is determined by the die and package. Therefore,
CTHERM1 through CTHERM5 and RTHERM1 through
RTHERM5 remain constant for each of the thermal models. A
listing of the model component values is available in Table 1.
1
10
2
Rev. A, June 4, 2001
10
3