FGH50N6S2D Fairchild Semiconductor, FGH50N6S2D Datasheet - Page 8

IGBT N-CHAN 600V 75A TO-247

FGH50N6S2D

Manufacturer Part Number
FGH50N6S2D
Description
IGBT N-CHAN 600V 75A TO-247
Manufacturer
Fairchild Semiconductor
Datasheet

Specifications of FGH50N6S2D

Voltage - Collector Emitter Breakdown (max)
600V
Vce(on) (max) @ Vge, Ic
2.7V @ 15V, 30A
Current - Collector (ic) (max)
75A
Power - Max
463W
Input Type
Standard
Mounting Type
Through Hole
Package / Case
TO-247-3
Transistor Type
IGBT
Dc Collector Current
75A
Collector Emitter Voltage Vces
2.7V
Power Dissipation Pd
463W
Collector Emitter Voltage V(br)ceo
600V
Transistor Case Style
TO-247
No. Of Pins
3
Svhc
No SVHC
Rohs Compliant
Yes
Operating Temperature Range
-55°C To +150°C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Igbt Type
-
Other names
FGH50N6S2D_NL
FGH50N6S2D_NL

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FGH50N6S2D
Manufacturer:
FAIRCHILD
Quantity:
12 500
©2002 Fairchild Semiconductor Corporation
Handling Precautions for IGBTs
Insulated Gate Bipolar Transistors are susceptible to
gate-insulation damage by the electrostatic discharge
of energy through the devices. When handling these
devices, care should be exercised to assure that the
static charge built in the handler’s body capacitance
is not discharged through the device. With proper
handling and application procedures, however,
IGBTs are currently being extensively used in
production by numerous equipment manufacturers in
military, industrial and consumer applications, with
virtually no damage problems due to electrostatic
discharge. IGBTs can be handled safely if the
following basic precautions are taken:
1. Prior to assembly into a circuit, all leads should be
2. When devices are removed by hand from their
3. Tips of soldering irons should be grounded.
4. Devices should never be inserted into or removed
5. Gate Voltage Rating - Never exceed the gate-
6. Gate Termination - The gates of these devices
7. Gate Protection - These devices do not have an
kept shorted together either by the use of metal
shorting springs or by the insertion into conduc-
tive material such as “ECCOSORBD™ LD26” or
equivalent.
carriers, the hand being used should be grounded
by any suitable means - for example, with a
metallic wristband.
from circuits with power on.
voltage rating of V
can result in permanent damage to the oxide layer
in the gate region.
are essentially capacitors. Circuits that leave the
gate open-circuited or floating should be avoided.
These conditions can result in turn-on of the
device due to voltage buildup on the input
capacitor due to leakage currents or pickup.
internal monolithic Zener diode from gate to
emitter. If gate protection is required an external
Zener is recommended.
GEM
. Exceeding the rated V
GE
ECCOSORBD is a Trademark of Emerson and Cumming, Inc.
Operating Frequency Information
Operating frequency information for a typical device
(Figure 3) is presented as a guide for estimating
device performance for a specific application. Other
typical frequency vs collector current (I
possible using the information shown for a typical unit
in Figures 5, 6, 7, 8, 9 and 11. The operating
frequency plot (Figure 3) of a typical device shows
f
The information is based on measurements of a
typical device and is bounded by the maximum rated
junction temperature.
f
Deadtime (the denominator) has been arbitrarily held
to 10% of the on-state time for a 50% duty factor.
Other definitions are possible. t
defined in Figure 27. Device turn-off delay can
establish an additional frequency limiting condition for
an application other than T
when controlling output ripple under a lightly loaded
condition.
f
The allowable dissipation (P
P
and conduction losses must not exceed P
duty factor was used (Figure 3) and the conduction
losses (P
E
waveforms shown in Figure 27. E
the instantaneous power loss (I
on and E
power loss (I
are included in the calculation for E
collector current equals zero (I
MAX1
MAX1
MAX2
D
ON2
= (T
and E
is defined by f
or f
is defined by f
JM
OFF
MAX2
C
- T
) are approximated by P
OFF
C
CE
is the integral of the instantaneous
)/R
; whichever is smaller at each point.
x V
are defined in the switching
JC
MAX2
CE
. The sum of device switching
MAX1
) during turn-off. All tail losses
= (P
= 0.05/(t
JM
D
) is defined by
D
. t
- P
CE
d(OFF)I
d(OFF)I
CE
ON2
C
= 0)
d(OFF)I
x V
)/(E
OFF
C
is the integral of
= (V
CE
OFF
and t
is important
CE
; i.e., the
) during turn-
+ t
) plots are
CE
+ E
D
FGH50N6S2D RevA2
d(ON)I
d(ON)I
. A 50%
x I
ON2
CE
).
).
are
)/2.

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