FDB2532_F085 Fairchild Semiconductor, FDB2532_F085 Datasheet

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FDB2532_F085

Manufacturer Part Number
FDB2532_F085
Description
MOSFET N-CH 150V 79A D2PAK
Manufacturer
Fairchild Semiconductor
Series
PowerTrench®r
Datasheet

Specifications of FDB2532_F085

Input Capacitance (ciss) @ Vds
5870pF @ 25V
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
16 mOhm @ 33A, 10V
Drain To Source Voltage (vdss)
150V
Current - Continuous Drain (id) @ 25° C
79A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
107nC @ 10V
Power - Max
310W
Mounting Type
Surface Mount
Package / Case
TO-263-3, D²Pak (2 leads + Tab), TO-263AB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
©2010 Fairchild Semiconductor Corporation
FDB2532_F085
N-Channel PowerTrench
150V, 79A, 16mΩ
Features
• r
• Q
• Low Miller Charge
• Low Q
• UIS Capability (Single Pulse and Repetitive Pulse)
• Qualified to AEC Q101
• RoHS Compliant
Formerly developmental type 82884
MOSFET Maximum Ratings
Thermal Characteristics
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a
R
V
V
I
E
P
T
R
D
GS
J
DSS
AS
D
θJC
θJA
Symbol
, T
All Fairchild Semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems
DS(ON)
g
(tot) = 82nC (Typ.), V
STG
RR
= 14mΩ (Typ.), V
Body Diode
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Continuous (T
Continuous (T
Continuous (T
Pulsed
Single Pulse Avalanche Energy (Note 1)
Power dissipation
Derate above 25
Operating and Storage Temperature
Thermal Resistance Junction to Case TO-263
Thermal Resistance Junction to Ambient TO-263, 1in
GATE
SOURCE
GS
GS
copy of the requirements, see AEC Q101 at: http://www.aecouncil.com/
amb
C
C
= 10V
= 10V, I
TO-263AB
FDB SERIES
= 25
= 100
o
C
= 25
o
C, V
o
o
C, V
D
C, V
(FLANGE)
®
= 33A
DRAIN
GS
GS
MOSFET
GS
= 10V)
Parameter
= 10V)
T
= 10V, R
C
= 25°C unless otherwise noted
θJA
certification.
= 43
o
C/W)
Applications
• DC/DC converters and Off-Line UPS
• Distributed Power Architectures and VRMs
• Primary Switch for 24V and 48V Systems
• High Voltage Synchronous Rectifier
• Direct Injection / Diesel Injection Systems
• 42V Automotive Load Control
• Electronic Valve Train Systems
2
copper pad area
G
D
S
-55 to 175
Ratings
Figure 4
2.07
0.48
150
400
310
±20
79
56
43
8
September 20
FDB2532_F085 Rev. A
Units
W/
o
o
C/W
C/W
mJ
o
W
V
V
A
A
A
A
C
o
C
10

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FDB2532_F085 Summary of contents

Page 1

... Automotive Load Control • Electronic Valve Train Systems DRAIN (FLANGE 25°C unless otherwise noted C Parameter 10V 10V 10V C/W) θ copper pad area certification. September Ratings Units 150 V ± Figure 4 A 400 mJ 310 -55 to 175 C o 0.48 C C/W FDB2532_F085 Rev ...

Page 2

... 33A 16A 33A, dI /dt= 100A/μ 33A, dI /dt= 100A/μ Tape Width Quantity 24mm 800 units Min Typ Max Units 150 - - μ 250 ±100 - - 0.014 0.016 - 0.016 0.024 Ω - 0.040 0.048 - 5870 - pF - 615 - pF - 135 - 107 1. 1 105 327 nC FDB2532_F085 Rev. A ...

Page 3

... Figure 2. Maximum Continuous Drain Current RECTANGULAR PULSE DURATION ( PULSE WIDTH (s) Figure 4. Peak Current Capability 50 75 100 125 150 CASE TEMPERATURE ( C) C Case Temperature NOTES: DUTY FACTOR PEAK θJC θ 10 FOR TEMPERATURES o ABOVE 25 C DERATE PEAK CURRENT AS FOLLOWS: 175 - 150 - FDB2532_F085 Rev. A 175 ...

Page 4

... STARTING T = 150 C J )/(1.3*RATED DSS DD *R)/(1.3*RATED +1] AS DSS DD 0.01 0 TIME IN AVALANCHE (ms) AV Capability 10V PULSE DURATION = 80μs DUTY CYCLE = 0.5% MAX 1.0 2.0 3.0 4.0 5 DRAIN TO SOURCE VOLTAGE ( 10V, I =33A 120 160 JUNCTION TEMPERATURE ( C) J FDB2532_F085 Rev 6.0 200 ...

Page 5

... C) Figure 12. Normalized Drain to Source Breakdown Voltage vs Junction Temperature ISS 150 Figure 14. Gate Charge Waveforms for Constant I = 250μ 120 160 JUNCTION TEMPERATURE ( 75V WAVEFORMS IN DESCENDING ORDER 33A 16A GATE CHARGE (nC) g Gate Currents FDB2532_F085 Rev. A 200 100 ...

Page 6

... Figure 19. Switching Time Test Circuit ©2010 Fairchild Semiconductor Corporation DUT 0.01Ω Figure 16. Unclamped Energy Waveforms DUT g(TH g(REF) 0 Figure 18. Gate Charge Waveforms d(ON 90 DUT V GS 50% 10% 0 Figure 20. Switching Time Waveforms BV DSS g(TOT 10V GS Q gs2 OFF t d(OFF 10% 10% 90% 50% PULSE WIDTH FDB2532_F085 Rev 90% ...

Page 7

... C/W) θ never exceeded (EQ 0.1 is (0.645) DM Figure 21. Thermal Resistance vs Mounting dissipation. Pulse (EQ. 2) Area in Inches Squared (EQ. 3) Area in Centimeters Squared R = 26.51+ 19.84/(0.262+Area) EQ.2 θ 26.51+ 128/(1.69+Area) EQ.3 θJA 1 (6.45) (64. AREA, TOP COPPER AREA in (cm ) Pad Area FDB2532_F085 Rev ...

Page 8

... Fairchild Semiconductor Corporation DPLCAP RSLC2 RDRAIN 6 ESG 8 EVTHRES + LGATE EVTEMP 8 RGATE + MSTRO RLGATE CIN S1A S2A S1B S2B EGS EDS LDRAIN DRAIN RLDRAIN RSLC1 DBREAK ESLC DBODY EBREAK MWEAK MMED LSOURCE SOURCE 8 7 RSOURCE RLSOURCE RBREAK 17 18 RVTEMP VBAT + 8 22 RVTHRES FDB2532_F085 Rev ...

Page 9

... RSLC2 - RDRAIN 6 ESG 8 EVTHRES + LGATE EVTEMP 8 RGATE + MSTRO RLGATE CIN S1A S2A S1B S2B EGS EDS LDRAIN DRAIN RLDRAIN RSLC1 ISCL DBREAK 50 11 DBODY 16 MWEAK EBREAK MMED + 17 18 LSOURCE - SOURCE 8 7 RSOURCE RLSOURCE RBREAK 17 18 RVTEMP VBAT + 8 22 RVTHRES FDB2532_F085 Rev ...

Page 10

... Fairchild Semiconductor Corporation JUNCTION th RTHERM1 CTHERM1 6 RTHERM2 CTHERM2 5 RTHERM3 CTHERM3 4 RTHERM4 CTHERM4 3 RTHERM5 CTHERM5 2 RTHERM6 CTHERM6 tl CASE FDB2532_F085 Rev. A ...

Page 11

... TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended exhaustive list of all such trademarks. AccuPower¥ F-PFS¥ Auto-SPM¥ FRFET Build it Now¥ Global Power Resource CorePLUS¥ ...

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