LRI64-SBN18/1GE STMicroelectronics, LRI64-SBN18/1GE Datasheet - Page 42

• Manufacturer Part Number: LRI64-SBN18/1GE
• Description: IC EEPROM MEMORY TAG WAFER
• Manufacturer: STMicroelectronics
• Series: LRI64r

Specifications of LRI64-SBN18/1GE

• Rf Type: Write Once Read Many (WORM)
• Frequency: 13.56MHz
• Features: ISO15693, ISO18000-3
• Package / Case: Wafer
• For Use With: 497-5538 - DEMO KIT LONG-RANGE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package mechanical data
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Package mechanical data
In order to meet environmental requirements, ST offers the LRI64 in ECOPACK
These packages have a Lead-free second-level interconnect. The category of second-level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 39. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
1. Drawing is not to scale.
Table 15.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
Symbol
ddd
measuring.
D2
A1
E2
L1
L3
A
D
E
b
e
L
(2)
2 × 3 mm, package outline
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 × 3 mm, package mechanical data
0.55
0.02
0.25
0.45
Typ
1.6
0.2
0.5
2
3
A
E
A1
millimeters
0.45
0.08
Min
0.2
1.9
1.5
2.9
0.1
0.4
0.3
0
-
D
Max
0.05
0.15
0.6
0.3
2.1
1.7
3.1
0.3
0.5
-
ddd
L3
0.0217
0.0008
0.0098
0.0787
0.1181
0.0079
0.0197
0.0177
0.063
Typ
D2
e
b
UFDFPN-01
inches
L1
E2
L
0.0177
0.0079
0.0748
0.0591
0.1142
0.0039
0.0157
0.0118
0.0031
Min
0
-
(1)
®
packages.
0.0236
0.0118
0.0827
0.0669
0.0118
0.0197
0.0059
0.002
0.122
Max
-
LRI64