MC68HC908JB8JDW Freescale Semiconductor, MC68HC908JB8JDW Datasheet - Page 266

IC MCU 8K FLASH 3MHZ 20-SOIC

MC68HC908JB8JDW

Manufacturer Part Number
MC68HC908JB8JDW
Description
IC MCU 8K FLASH 3MHZ 20-SOIC
Manufacturer
Freescale Semiconductor
Series
HC08r
Datasheet

Specifications of MC68HC908JB8JDW

Core Processor
HC08
Core Size
8-Bit
Speed
3MHz
Connectivity
USB
Peripherals
LVD, POR, PWM
Number Of I /o
13
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-

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Manufacturer
Quantity
Price
Part Number:
MC68HC908JB8JDW
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Part Number:
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Manufacturer:
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Part Number:
MC68HC908JB8JDWE
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Mechanical Specifications
19.6 20-Pin Small Outline Integrated Circuit (SOIC)
Technical Data
266
20
1
20X
18X
0.010 (0.25)
–A–
D
G
M
T
A
11
10
Figure 19-4. 20-Pin SOIC (Case 751D)
–B–
S
K
C
B
S
10X
–T–
P
Mechanical Specifications
0.010 (0.25)
SEATING
PLANE
J
F
MC68HC908JB8•MC68HC08JB8•MC68HC08JT8 — Rev. 2.3
M
B
M
M
R
X 45
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.150
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
(0.006) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
G
K
M
P
R
F
J
12.65
10.05
MILLIMETERS
Freescale Semiconductor
MIN
7.40
2.35
0.35
0.50
0.25
0.10
0.25
1.27 BSC
0
12.95
10.55
MAX
7.60
2.65
0.49
0.90
0.32
0.25
0.75
7
0.499
0.292
0.093
0.014
0.020
0.010
0.004
0.395
0.010
MIN
0.050 BSC
0
INCHES
MAX
0.510
0.299
0.104
0.019
0.035
0.012
0.009
0.415
0.029
7

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