UPD70F3735GK-GAK-AX Renesas Electronics America, UPD70F3735GK-GAK-AX Datasheet - Page 775

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UPD70F3735GK-GAK-AX

Manufacturer Part Number
UPD70F3735GK-GAK-AX
Description
MCU 32BIT V850ES/JX3-L 80-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet

Specifications of UPD70F3735GK-GAK-AX

Core Processor
RISC
Core Size
32-Bit
Speed
20MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
66
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b, D/A 1x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3735GK-GAK-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
V850ES/JF3-L
(T
Note
Cautions 1. Be sure to disconnect the internal feedback resistor after reset (set PCC.MFRC = 1).
Subclock Oscillator Characteristics
(T
Notes 1. The oscillation frequency shown above indicates only oscillator characteristics. Use the V850ES/JF3-L so that
Cautions 1.
R01UH0017EJ0400 Rev.4.00
Sep 30, 2010
External
clock
Crystal
resonator
Resonator
A
A
Resonator
= −40 to +85°C, V
= −40 to +85°C, V
Keep the duty factor of the input waveform to within 45% to 55%.
2. Time required from when V
2. Leave the X2 pin open.
3. Make sure that the CMOS inverter is as close to the X1 pin as possible.
4. Thoroughly evaluate matching between the V850ES/JF3-L and CMOS inverter.
2.
3.
the internal operation conditions do not exceed the ratings shown in AC Characteristics and DC
Characteristics.
stabilizes.
When using the subclock oscillator, wire as follows in the area enclosed by the broken lines in the
above figures to avoid an adverse effect from wiring capacitance.
• Keep the wiring length as short as possible.
• Do not cross the wiring with the other signal lines.
• Do not route the wiring near a signal line through which a high fluctuating current flows.
• Always make the ground point of the oscillator capacitor the same potential as V
• Do not ground the capacitor to a ground pattern through which a high current flows.
• Do not fetch signals from the oscillator.
The subclock oscillator is designed as a low-amplitude circuit for reducing power consumption,
and is more prone to malfunction due to noise than the main clock oscillator.
Particular care is therefore required with the wiring method when the subclock is used.
For the resonator selection and oscillator constant, customers are requested to either evaluate the
oscillation themselves or apply to the resonator manufacturer for evaluation.
External clock
Circuit Example
XT1
Circuit Example
X1
DD
DD
= EV
= EV
inverter
CMOS
Open
DD
DD
X2
XT2
= AV
= AV
REF0
REF0
DD
Oscillation frequency
(f
Oscillation
stabilization time
Input frequency (f
V
V
XT
reaches the oscillation voltage range (2.2 V (MIN.)) to when the crystal resonator
= AV
IH
IL
= AV
)
Note 1
Parameter
Parameter
REF1
REF1
= 2.2 to 3.6 V, V
= 2.7 to 3.6 V, V
Note 2
X
)
Note
Clock through mode
PLL mode
X1
X1
Conditions
SS
CHAPTER 30 ELECTRICAL SPECIFICATIONS
SS
Conditions
= EV
= EV
SS
SS
= AV
= AV
SS
SS
MIN.
32
= 0 V)
= 0 V)
MIN.
V
2.5
2.5
2.3
SS
32.768
TYP.
TYP.
MAX.
35
10
SS
MAX.
V
0.4
.
5
5
Page 759 of 816
DD
Unit
kHz
MHz
MHz
s
Unit
V
V

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