UPD70F3735GK-GAK-AX Renesas Electronics America, UPD70F3735GK-GAK-AX Datasheet - Page 757

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UPD70F3735GK-GAK-AX

Manufacturer Part Number
UPD70F3735GK-GAK-AX
Description
MCU 32BIT V850ES/JX3-L 80-LQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Jx3-Lr
Datasheet

Specifications of UPD70F3735GK-GAK-AX

Core Processor
RISC
Core Size
32-Bit
Speed
20MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, LVD, PWM, WDT
Number Of I /o
66
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b, D/A 1x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3735GK-GAK-AX
Manufacturer:
Renesas Electronics America
Quantity:
10 000
V850ES/JF3-L
29.1.6 Cautions
R01UH0017EJ0400 Rev.4.00
Sep 30, 2010
(1) If a reset signal is input (from the target system or a reset signal from an internal reset source) during RUN
(2) Even if the reset signal is masked by the mask function, the I/O buffer (port pin) may be reset if a reset signal is
(3) Pin reset during a break is masked and the CPU and peripheral I/O are not reset. If pin reset or internal reset is
(4) In the on-chip debug mode, the DDO pin is forcibly set to the high-level output.
(5) On-chip debugging can be used when the supply voltage (V
(6) In the on-chip debug mode, the output voltage of the regulator does not decrease even in the low-voltage STOP
(program execution), the break function may malfunction.
input from a pin.
generated as soon as the flash memory is rewritten by DMM or read by the RAM monitor function while the user
program is being executed, the CPU and peripheral I/O may not be correctly reset.
less than 2.7 V.
mode, low-voltage subclock operation mode, or low-voltage sub-IDLE mode
DD
CHAPTER 29 ON-CHIP DEBUG FUNCTION
) is in a range of 2.7 to 3.6 V. It cannot be used at
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