DF2210CUNP24V Renesas Electronics America, DF2210CUNP24V Datasheet - Page 649

MCU 16BIT FLASH 3V 32K 64-QFN

DF2210CUNP24V

Manufacturer Part Number
DF2210CUNP24V
Description
MCU 16BIT FLASH 3V 32K 64-QFN
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2210CUNP24V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
24MHz
Connectivity
SCI, SmartCard, USB
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
37
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 6x10b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
64-QFN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2210CUNP24V
Manufacturer:
Renesas Electronics America
Quantity:
135
This LSI incorporates a masked ROM which has the following features.
18.1
• Size
Product Class
H8S/2218 Group
H8S/2212 Group
• Connected to the bus master through 16-bit data bus, enabling one-state access to both byte
Figure 18.1 shows a block diagram of the on-chip masked ROM.
data and word data.
Features
Figure 18.1 Block Diagram of On-Chip Masked ROM (64 kbytes)
HD6432217
HD6432211
HD6432210, HD6432210S
Section 18 Masked ROM
H'00FFFE
H'000000
H'000002
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
ROM Size
64 kbytes
64 kbytes
32 kbytes
H'00FFFF
H'000001
H'000003
Rev.7.00 Dec. 24, 2008 Page 593 of 698
ROM Address (Modes 6 and 7)
H'000000 to H'00FFFF
H'000000 to H'00FFFF
H'000000 to H'007FFF
REJ09B0074-0700

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