HD64F3672FPIV Renesas Electronics America, HD64F3672FPIV Datasheet - Page 92

MCU 3/5V 16K I-TEMP PB-FREE 64-L

HD64F3672FPIV

Manufacturer Part Number
HD64F3672FPIV
Description
MCU 3/5V 16K I-TEMP PB-FREE 64-L
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3672FPIV

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
PWM, WDT
Number Of I /o
26
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Section 5 Clock Pulse Generators
5.1.1
Figure 5.3 shows a typical method of connecting a crystal resonator. An AT-cut parallel-resonance
crystal resonator should be used. Figure 5.4 shows the equivalent circuit of a crystal resonator. A
resonator having the characteristics given in table 5.1 should be used.
Table 5.1
5.1.2
Figure 5.5 shows a typical method of connecting a ceramic resonator.
Rev.4.00 Nov. 02, 2005 Page 66 of 304
REJ09B0143-0400
Frequency (MHz)
R
C
S
0
(max)
(max)
Connecting Crystal Resonator
Connecting Ceramic Resonator
Crystal Resonator Parameters
OSC
Figure 5.5 Typical Connection to Ceramic Resonator
Figure 5.3 Typical Connection to Crystal Resonator
Figure 5.4 Equivalent Circuit of Crystal Resonator
1
OSC
OSC
2
500
7 pF
1
2
OSC
OSC
1
2
L
S
4
120
7 pF
C
S
C
C
1
2
C
C
C
1
2
0
8
80
7 pF
C = C = 10 to 22 pF
1
R
S
C
C
1
2
= 5 to 30 pF
= 5 to 30 pF
2
10
60
7 pF
OSC
2
16
50
7 pF

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