HD64F3672FPIV Renesas Electronics America, HD64F3672FPIV Datasheet - Page 43

MCU 3/5V 16K I-TEMP PB-FREE 64-L

HD64F3672FPIV

Manufacturer Part Number
HD64F3672FPIV
Description
MCU 3/5V 16K I-TEMP PB-FREE 64-L
Manufacturer
Renesas Electronics America
Series
H8® H8/300H Tinyr
Datasheet

Specifications of HD64F3672FPIV

Core Processor
H8/300H
Core Size
16-Bit
Speed
16MHz
Connectivity
SCI
Peripherals
PWM, WDT
Number Of I /o
26
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
R0K436079S000BE - KIT DEV FOR H8/36079 W/COMPILER
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Table 2.2
Note:
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
*
Refers to the operand size.
B: Byte
W: Word
L: Longword
Data Transfer Instructions
Size*
B/W/L
B
B
W/L
W/L
Function
(EAs)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
(EAs)
Rs
@SP+
Pops a general register from the stack. POP.W Rn is identical to
MOV.W @SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn.
Rn
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @–SP. PUSH.L ERn is identical to MOV.L ERn, @–SP.
@–SP
(EAs) Cannot be used in this LSI.
Rd, Rs
Rd, Cannot be used in this LSI.
Rn
(EAd)
Rev.4.00 Nov. 02, 2005 Page 17 of 304
REJ09B0143-0400
Section 2 CPU

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