PIC16F688-E/P Microchip Technology, PIC16F688-E/P Datasheet - Page 66

• Manufacturer Part Number: PIC16F688-E/P
• Description: IC MCU PIC FLASH 4KX14 14DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F688-E/P

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 14-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 12
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: SCI/USART
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162066 - HEADER INTRFC MPLAB ICD2 20PINAC162061 - HEADER INTRFC MPLAB ICD2 20PINDM163029 - BOARD PICDEM FOR MECHATRONICSAC162056 - HEADER INTERFACE ICD2 16F688ACICE0207 - MPLABICE 14P 300 MIL ADAPTER
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PICmicro MID-RANGE MCU FAMILY
3.4
DS31003A-page 3-16
Design Tips
Question 1:
Answer 1:
If the device you are using does not have filtering to the on-chip master clear circuit
ensure that proper external filtering is placed on the MCLR pin to remove narrow pulses. Electri-
cal Specification
Question 2:
Answer 2:
The most common reason for this is that the windowed device (JW) has not had its window cov-
ered. The background light causes the device to power-up in a different state than would typically
be seen in a device where no light is present. In most cases all the General Purpose RAM and
Special Function Registers were not initialized properly.
When my system is subjected to an environment with ESD and EMI, it oper-
ates erratically.
With JW (windowed) devices my system resets and operates properly. With
an OTP device, my system does not operate properly.
parameter 35
specifies the pulse width required to cause a reset.
1997 Microchip Technology Inc.
(Appendix
C),