MC705P6ACDWE Freescale Semiconductor, MC705P6ACDWE Datasheet - Page 93

IC MCU 176 BYTES RAM 28-SOIC

MC705P6ACDWE

Manufacturer Part Number
MC705P6ACDWE
Description
IC MCU 176 BYTES RAM 28-SOIC
Manufacturer
Freescale Semiconductor
Series
HC05r
Datasheet

Specifications of MC705P6ACDWE

Core Processor
HC05
Core Size
8-Bit
Speed
2.1MHz
Connectivity
SIO
Peripherals
POR, WDT
Number Of I /o
21
Program Memory Size
4.5KB (4.5K x 8)
Program Memory Type
OTP
Ram Size
176 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Processor Series
HC705P
Core
HC05
Data Bus Width
8 bit
Data Ram Size
176 B
Maximum Clock Frequency
2.1 MHz
Number Of Programmable I/os
21
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

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Chapter 15
Mechanical Specifications
15.1 Introduction
The MC68HC705P6A is available in either a 28-pin plastic dual in-line (PDIP) or a 28-pin small outline
integrated circuit (SOIC) package.
15.2 Plastic Dual In-Line Package (Case 710)
Freescale Semiconductor
H
28
1
G
A
F
MC68HC705P6A Advance Information Data Sheet, Rev. 2.1
D
15
14
SEATING
PLANE
N
B
K
C
M
L
J
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
2. DIMENSION L TO CENTER OF LEADS
3. DIMENSION B DOES NOT INCLUDE
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
G
M
A
B
C
D
F
H
J
K
L
N
MILLIMETERS
36.45
13.72
MIN
3.94
0.36
1.02
1.65
0.20
2.92
0.51
15.24 BSC
2.54 BSC
37.21
14.22
MAX
5.08
0.56
1.52
2.16
0.38
3.43
15°
1.02
1.435
0.540
0.155
0.014
0.040
0.065
0.008
0.115
0.020
MIN
0.100 BSC
0.600 BSC
INCHES
MAX
1.465
0.560
0.200
0.022
0.060
0.085
0.015
0.135
0.040
15°
93

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