MC9S08DZ60ACLF Freescale Semiconductor, MC9S08DZ60ACLF Datasheet - Page 18

• Manufacturer Part Number: MC9S08DZ60ACLF
• Description: IC MCU 60K FLASH 4K RAM 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08DZ60ACLF

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: CAN, I²C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 60KB (60K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 2K x 8
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: S08DZ
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: CAN, I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 2
• Operating Supply Voltage: 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08DZ60
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 24 Channel
• For Use With: DEMO9S08DZ60 - BOARD DEMOEVB9S08DZ60 - BOARD EVAL FOR 9S08DZ60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Section Number
17.1 Introduction ....................................................................................................................................379
17.2 Background Debug Controller (BDC) ...........................................................................................380
17.3 Register Definition .........................................................................................................................387
18.1 Introduction ....................................................................................................................................393
18.2 Signal Description ..........................................................................................................................394
18.3 Memory Map and Registers ...........................................................................................................395
18.4 Functional Description ...................................................................................................................410
18.5 Resets .............................................................................................................................................416
18.6 Interrupts ........................................................................................................................................417
18.7 Electrical Specifications .................................................................................................................417
A.1 Introduction ...................................................................................................................................419
A.2 Parameter Classification ................................................................................................................419
A.3 Absolute Maximum Ratings ..........................................................................................................419
A.4 Thermal Characteristics .................................................................................................................420
18
17.1.1 Forcing Active Background ............................................................................................379
17.1.2 Features ...........................................................................................................................380
17.2.1 BKGD Pin Description ...................................................................................................381
17.2.2 Communication Details ..................................................................................................381
17.2.3 BDC Commands .............................................................................................................385
17.2.4 BDC Hardware Breakpoint .............................................................................................387
17.3.1 BDC Registers and Control Bits .....................................................................................388
17.3.2 System Background Debug Force Reset Register (SBDFR) ..........................................390
18.1.1 Features ...........................................................................................................................393
18.1.2 Modes of Operation ........................................................................................................394
18.1.3 Block Diagram ................................................................................................................394
18.3.1 Module Memory Map .....................................................................................................395
18.3.2
18.3.3 Register Descriptions ......................................................................................................397
18.4.1 Comparator .....................................................................................................................410
18.4.2 Breakpoints .....................................................................................................................411
18.4.3 Trigger Selection .............................................................................................................411
18.4.4 Trigger Break Control (TBC) .........................................................................................412
18.4.5 FIFO ................................................................................................................................415
18.4.6 Interrupt Priority .............................................................................................................416
Debug Module (S08DBGV3) (128K)
MC9S08DZ128 Series Data Sheet, Rev. 1
Electrical Characteristics
Development Support
Appendix A
Chapter 17
Chapter 18
Title
Freescale Semiconductor
Page
396