PIC18C442-I/P Microchip Technology, PIC18C442-I/P Datasheet - Page 218

IC MCU OTP 8KX16 A/D 40DIP

PIC18C442-I/P

Manufacturer Part Number
PIC18C442-I/P
Description
IC MCU OTP 8KX16 A/D 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Cr

Specifications of PIC18C442-I/P

Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Number Of I /o
33
Program Memory Type
OTP
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Controller Family/series
PIC18
No. Of I/o's
34
Ram Memory Size
512Byte
Cpu Speed
40MHz
No. Of Timers
4
Processor Series
PIC18C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
MSSP, SPI, I2C, PSP, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
34
Number Of Timers
1 x 16 bit
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
ICE2000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
For Use With
I3DB18C452 - BOARD DAUGHTER ICEPIC3444-1001 - DEMO BOARD FOR PICMICRO MCU
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18C442-I/P
Manufacturer:
Microchip
Quantity:
731
Part Number:
PIC18C442-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC18CXX2
POP
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
DS39026C-page 216
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
Stack (1 level down)= 014332h
TOS
PC
Q1
operation
Pop Top of Return Stack
[ label ]
None
(TOS)
None
The TOS value is pulled off the
return stack and is discarded. The
TOS value then becomes the previ-
ous value that was pushed onto the
return stack.
This instruction is provided to
enable the user to properly manage
the return stack to incorporate a
software stack.
1
1
POP
GOTO
0000
No
Q2
bit bucket
POP
0000
NEW
POP TOS
value
= 0031A2h
= 014332h
= NEW
Q3
0000
operation
No
Q4
0110
PUSH
Syntax:
Operands:
Operation:
Status Affected:
Encoding:
Description:
Words:
Cycles:
Example:
Q Cycle Activity:
Before Instruction
After Instruction
Decode
TOS
PC
PC
TOS
Stack (1 level down)
Q1
PUSH PC+2
onto return
Push Top of Return Stack
[ label ]
None
(PC+2)
None
The PC+2 is pushed onto the top of
the return stack. The previous TOS
value is pushed down on the stack.
This instruction allows to implement
a software stack by modifying TOS,
and then push it onto the return
stack.
1
1
PUSH
stack
0000
Q2
2001 Microchip Technology Inc.
PUSH
TOS
0000
operation
No
Q3
=
=
=
=
=
0000
00345Ah
000124h
000126h
000126h
00345Ah
operation
Q4
No
0101

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