MT48H8M32LFB5-10 IT Micron Technology Inc, MT48H8M32LFB5-10 IT Datasheet - Page 75

• Manufacturer Part Number: MT48H8M32LFB5-10 IT
• Description: IC SDRAM 256MBIT 100MHZ 90VFBGA
• Manufacturer: Micron Technology Inc
• Type: Mobile SDRAMr

Specifications of MT48H8M32LFB5-10 IT

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 256M (8Mx32)
• Speed: 100MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 90-VFBGA
• Organization: 8Mx32
• Density: 256Mb
• Address Bus: 14b
• Access Time (max): 17/8/7ns
• Maximum Clock Rate: 104MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: VFBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 65mA
• Pin Count: 90
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Dimensions
Figure 53: 90-Ball VFBGA (8mm x 13mm)
PDF: 09005aef80d460f2/Source: 09005aef80cd8d41
256Mb SDRAM x32_2.fm - Rev. G 6/05
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø0.42
90X Ø0.45 ±0.05
SEATING PLANE
for production devices. Although considered final, these specifications are subject to change, as further product
11.20 ±0.10
0.10 C
BALL A9
5.60 ±0.05
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
Note:
C
0.65 ±0.05
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
3.20 ±0.05
All other trademarks are the property of their respective owners.
All dimensions are in millimeters.
development and data characterization sometimes occur.
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
0.80 TYP
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
13.00 ±0.10
75
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
256Mb: x32 Mobile SDRAM
SOLDER BALL MATERIAL: 62% Sn, 36% Pb, 2% Ag OR
96.5% Sn, 3%Ag, 0.5% Cu
SOLDER MASK DEFINED BALL PADS: Ø0.40
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
Package Dimensions
©2003 Micron Technology, Inc. All rights reserved.
BALL A1 ID