SL1ICS3001W/N4D NXP Semiconductors, SL1ICS3001W/N4D Datasheet - Page 8

• Manufacturer Part Number: SL1ICS3001W/N4D
• Description: RF Wireless Misc ICODE 1 FFC
• Manufacturer: NXP Semiconductors
• Type: Sawn Wafer on Foilr

Specifications of SL1ICS3001W/N4D

• Package / Case: Die
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SL1ICS3001W/N4D,00

Philips Semiconductors
8
In accordance with the Absolute Maximum Rating System (IEC 60134); notes 1 and 2.
Notes
1. Stresses above those listed in this table may cause permanent damage to the device. This is a stress rating only and
2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects
3. Human Body Model (HBM) in accordance with “MIL-STD-883D Method 3015.7” .
9
9.1
The electrical acceptance test is performed in line
(‘sampling on the fly’) according to the test specifications.
Sampling plan:
9.2
9.2.1
Performed according to document “SNW-FQ-627” .
Sampling plan:
9.2.2
Performed according to document “PICTOH-QS007”.
Sampling plan (3 wafers per lot):
2002 May 23
T
T
V
I
i(LA-LB)(p)
SYMBOL
stg
j
esd
According to document “General quality specification” .
According to document “General quality specification” .
Accept 0 to 3.
I-CODE1 Label IC
functional operation of the device at these or any conditions other than those described in Chapter 11 is not implied.
of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying
greater than the rated maxima.
LIMITING VALUES
QUALITY ASSURANCE
Electrical acceptance test
Visual inspection
A
A
FTER WAFER FINAL TEST
FTER SAWING
storage temperature
junction temperature
electrostatic discharge voltage
input current (peak value)
(
FILM FRAME CARRIER
PARAMETER
)
note 3
CONDITIONS
8
10 HANDLING INSTRUCTIONS
Please refer to Philips “General specification for 6” wafer”
for the following items:
Sawing
Die attach
Wire bonding.
55
55
2
60
MIN.
TYP.
SL1ICS3001
Product specification
+140
+140
2
60
MAX.
kV
mA
C
C
UNIT