SL1ICS3001W/N4D NXP Semiconductors, SL1ICS3001W/N4D Datasheet - Page 4

• Manufacturer Part Number: SL1ICS3001W/N4D
• Description: RF Wireless Misc ICODE 1 FFC
• Manufacturer: NXP Semiconductors
• Type: Sawn Wafer on Foilr

Specifications of SL1ICS3001W/N4D

• Package / Case: Die
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SL1ICS3001W/N4D,00

Philips Semiconductors
5
6
2002 May 23
handbook, full pagewidth
LA
LB
TEST
VSS
SYMBOL
I-CODE1 Label IC
BLOCK DIAGRAM
PINNING
bond pad for antenna coil connection A
bond pad for antenna coil connection B
test pad; this test pad is electrically neutral
at sawn wafers
electrical connection of the substrate pad;
the pad is electrically neutral at sawn
wafers
DESCRIPTION
TEST
VSS
LA
LB
C res
SUPPLY
POWER
ANTICOLLISION
READ/WRITE CONTROL
ACCESS CONTROL
EEPROM INTERFACE CONTROL
RF INTERFACE CONTROL
VDD
Fig.1 Block diagram.
DEMODULATOR
4
DATA
EEPROM
IN
512 bits
handbook, halfpage
ANALOG RF INTERFACE
MODULATOR
DIGITAL CONTROL
SL1ICS3001
DATA
OUT
LA
VSS
Fig.2 Pad locations.
CLOCK
CLOCK
TEST
MGW339
SL1ICS3001
Product specification
MGW340
LB