SL1ICS3001W/N4D NXP Semiconductors, SL1ICS3001W/N4D Datasheet - Page 16

• Manufacturer Part Number: SL1ICS3001W/N4D
• Description: RF Wireless Misc ICODE 1 FFC
• Manufacturer: NXP Semiconductors
• Type: Sawn Wafer on Foilr

Specifications of SL1ICS3001W/N4D

• Package / Case: Die
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SL1ICS3001W/N4D,00

Philips Semiconductors
14 DELIVERY
14.1
The SL1ICS3001 is delivered with the following
configuration by Philips:
Remark: As the status of the QUIET mode is not defined
at delivery, the first command to be executed on the
SL1ICS3001 should be the command RESET QUIET BIT.
14.2
The packing for shipment of wafers has to protect the
wafers against shock, severe impact, dust and
electrostatic discharge. The packing of unsawn wafers or
sawn wafers is done according to Philips “General
Specification for 6" wafer” .
14.3
14.3.1
Each wafer container and each larger shipment container
is individually marked with the identification information as
follows.
The print out of the final test results is attached to the
packing and contains the good die quantity related to
every wafer number.
2002 May 23
Serial number is unique and read only
Write access conditions allow to change all blocks (with
the exception of both serial number blocks)
Status of the EAS mode is not defined
Status of the QUIET mode is not defined
Family code and application identifier are not defined
User data memory is not defined.
Diffusion batch number (wafer lot number)
Part designation (type) with revision number
Ordering code
Date code of lot acceptance
Good die quantity.
I-CODE1 Label IC
Configuration of delivered ICs
Packing
Documentation
D
ELIVERY DOCUMENTATION
16
14.3.2
Every die is electrically tested according to the data sheet.
Identification of the chips which do not confirm with the
electrical parameters of the data sheet is done by inking
and/or wafer mapping (all dies at wafer periphery are
identified by ‘FAIL’).
14.3.3
Wafer mapping for failed die identification is available on
floppy-disk (format 3.5”, Electroglas ESC-ASCEND).
Remark: The wafer map refers to unsawn wafers. At sawn
wafers (on FFC) additional ICs might be inked (marked as
‘FAIL’) if damaged during the sawing process (compared
to wafer map).
See Fig.6 for an example of the screen shot of a wafer
map.
F
W
AIL
AFER MAPPING
-
DIE IDENTIFICATION
SL1ICS3001
Product specification