SL1ICS3001W/N4D NXP Semiconductors, SL1ICS3001W/N4D Datasheet - Page 15

• Manufacturer Part Number: SL1ICS3001W/N4D
• Description: RF Wireless Misc ICODE 1 FFC
• Manufacturer: NXP Semiconductors
• Type: Sawn Wafer on Foilr

Specifications of SL1ICS3001W/N4D

• Package / Case: Die
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SL1ICS3001W/N4D,00

Philips Semiconductors
13 APPLICATION INFORMATION
13.1
As a result of the ultra low power design of the
SL1ICS3001 some analog circuits on the chip are light
sensitive. This means that common sunlight can impact
the operation of the label if the chip is not protected against
visible light radiation.
Measurements have shown that a maximum radiation of
E = 60 W/m
reduced operating range of the plain chip.
Measurements of direct sunlight in summer deliver values
up to 260 W/m
To ensure proper operation an expected minimum
radiation reduction factor of approximately 2
(round 9) must be provided by the encapsulation. That
means special care has to be taken to ensure a sufficient
light protection of the SL1ICS3001 (e.g. non translucent
encapsulation or underfiller) according to application
requirements.
13.2
An EEPROM memory, as used in the SL1ICS3001, has
some principle sensitivity to UV light (applies to EEPROM
technology in general).
Thus strong UV light exposure in the production of inlets or
labels has to be avoided. UV light protection has to be
ensured using appropriate assembly methods.
13.3
X-ray exposure on comparable Philips ICs (with even
smaller feature size) caused neither a long term influence
on the behaviour of the ICs nor on the data retention of the
EEPROMs.
Table 7 Inlet and label parameters
Note
1. If no command is transmitted to the inlet or label, then the label generates no response and there is no modulation.
2002 May 23
f
H
H
SYMBOL
res
TH
WR
I-CODE1 Label IC
Protection against visible light
Protection against UV light
Resistance to X-rays
2
resonant frequency
threshold value for the field strength for
command UNSELECTED READ (standard
mode)
threshold value for the field strength for
command WRITE (standard mode)
(spectrum: 400 to 1000 nm) causes a
2
.
PARAMETER
260
--------- -
60
= 8.7
15
at T
command UNSELECTED READ is OK
command WRITE (and verifying read) is OK
13.4
The parameters recommended to be characterised for the
inlet and label are given in Table 7.
13.5
Basic flow for production and test:
To detect damage of EEPROM cells during production of
inlets and labels a final test of the EEPROM after assembly
of the inlet or label is recommended. This is necessary to
achieve lowest failure rates.
13.6
The SL1ICS3001 has to be connected at pads LA and LB
to a coil characterised by its electrical parameters
according to Philips application note “SL1ICS3001
I-CODE1 Label IC, Coil Design Guide” .
Production of wafer
Testing of dies on wafer
Writing of serial numbers and pre-configuration
Sawing of wafer
Assembly of inlets and labels
Final test of inlets and labels
Writing of customer data.
amb
= 22 C and H
Characterisation of inlet and label
Final test of the inlet and label
Coil specification
CONDITIONS
TH
; note 1
SL1ICS3001
Product specification