SL1ICS3001W/N4D NXP Semiconductors, SL1ICS3001W/N4D Datasheet - Page 14
SL1ICS3001W/N4D
Manufacturer Part Number
SL1ICS3001W/N4D
Description
RF Wireless Misc ICODE 1 FFC
Manufacturer
NXP Semiconductors
Type
Sawn Wafer on Foilr
Datasheet
1.SL1ICS3001WN4D.pdf
(20 pages)
Specifications of SL1ICS3001W/N4D
Package / Case
Die
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 25 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SL1ICS3001W/N4D,00
Philips Semiconductors
2002 May 23
handbook, full pagewidth
I-CODE1 Label IC
Dimensions in mm.
The three black areas show the position of the Process Control Module (PCM) structures on the 6 inch wafer.
Fig.5 Cluster map.
14
MGW358
SL1ICS3001
Product specification
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