SL1ICS3001W/N4D NXP Semiconductors, SL1ICS3001W/N4D Datasheet - Page 2

• Manufacturer Part Number: SL1ICS3001W/N4D
• Description: RF Wireless Misc ICODE 1 FFC
• Manufacturer: NXP Semiconductors
• Type: Sawn Wafer on Foilr

Specifications of SL1ICS3001W/N4D

• Package / Case: Die
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SL1ICS3001W/N4D,00

Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
8
9
9.1
9.2
9.2.1
9.2.2
10
11
12
12.1
12.2
13
13.1
13.2
13.3
13.4
13.5
13.6
2002 May 23
I-CODE1 Label IC
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
General
Memory organization
Serial number
Write access conditions
Special functions
Family code and application identifier
User data
LIMITING VALUES
QUALITY ASSURANCE
Electrical acceptance test
Visual inspection
After wafer final test
After sawing (film frame carrier)
HANDLING INSTRUCTIONS
ELECTRICAL CHARACTERISTICS
MECHANICAL CHARACTERISTICS
Die specifications
Wafer specifications
APPLICATION INFORMATION
Protection against visible light
Protection against UV light
Resistance to X-rays
Characterisation of inlet and label
Final test of the inlet and label
Coil specification
2
14
14.1
14.2
14.3
14.3.1
14.3.2
14.3.3
15
16
17
18
DELIVERY
Configuration of delivered ICs
Packing
Documentation
Delivery documentation
Fail-die identification
Wafer mapping
REFERENCE DOCUMENTS
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
Product specification
SL1ICS3001