SL1ICS3001W/N4D NXP Semiconductors, SL1ICS3001W/N4D Datasheet

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SL1ICS3001W/N4D

Manufacturer Part Number
SL1ICS3001W/N4D
Description
RF Wireless Misc ICODE 1 FFC
Manufacturer
NXP Semiconductors
Type
Sawn Wafer on Foilr
Datasheet

Specifications of SL1ICS3001W/N4D

Package / Case
Die
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
- 25 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
SL1ICS3001W/N4D,00
Product specification
Supersedes data of 2000 May 02
DATA SHEET
SL1ICS3001
I-CODE1 Label IC
INTEGRATED CIRCUITS
2002 May 23

Related parts for SL1ICS3001W/N4D

SL1ICS3001W/N4D Summary of contents

Page 1

DATA SHEET SL1ICS3001 I-CODE1 Label IC Product specification Supersedes data of 2000 May 02 INTEGRATED CIRCUITS 2002 May 23 ...

Page 2

Philips Semiconductors I-CODE1 Label IC CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 ORDERING INFORMATION 5 BLOCK DIAGRAM 6 PINNING 7 FUNCTIONAL DESCRIPTION 7.1 General 7.2 Memory organization 7.2.1 Serial number 7.2.2 Write access conditions 7.2.3 Special functions 7.2.4 ...

Page 3

Philips Semiconductors I-CODE1 Label IC 1 FEATURES Operating frequency of 13.56 MHz 512-bit read/write memory Operating range up to 1.5 m with Electronic Article Surveillance (EAS) detection and up to 1.2 m for memory read and write Anticollision: simultaneous operation ...

Page 4

Philips Semiconductors I-CODE1 Label IC 5 BLOCK DIAGRAM handbook, full pagewidth LA LB TEST VSS 6 PINNING SYMBOL DESCRIPTION LA bond pad for antenna coil connection A LB bond pad for antenna coil connection B TEST test pad; this test ...

Page 5

Philips Semiconductors I-CODE1 Label IC 7 FUNCTIONAL DESCRIPTION This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on Film Frame Carrier (FFC) of the SL1ICS3001 on a Philips 6C15 IDFW process and is the base ...

Page 6

Philips Semiconductors I-CODE1 Label IC 7.2.1 S ERIAL NUMBER The unique 64-bit serial number is stored in blocks 0 and 1 and is programmed during the production process. Byte SNR0 in the table represents the least significant byte and byte ...

Page 7

Philips Semiconductors I-CODE1 Label IC 7.2.3 S PECIAL FUNCTIONS The special functions block 3 (see Table 5) holds the two bits E (EAS mode) and two bits Q (QUIET mode). The remaining 28 bits (marked X) are reserved for future ...

Page 8

Philips Semiconductors I-CODE1 Label IC 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); notes 1 and 2. SYMBOL PARAMETER T storage temperature stg T junction temperature j V electrostatic discharge voltage esd I input current ...

Page 9

Philips Semiconductors I-CODE1 Label IC 11 ELECTRICAL CHARACTERISTICS +70 C; unless otherwise specified. amb SYMBOL PARAMETER General T ambient temperature amb T junction temperature j Supply P minimum operating power min Inputs C capacitance between res ...

Page 10

Philips Semiconductors I-CODE1 Label – max min 5. Definition ----------------------------- - max min 6. Bandwidth limitation ( 7 kHz) according to ISM band regulations. 7. The given values are derived from the ...

Page 11

Philips Semiconductors I-CODE1 Label IC handbook, full pagewidth 130 LA 150 139.7 (1) 1490 1410 233.7 90 Dimensions in m. (1) Including 80 m scribe line. 2002 May 23 90 96.5 144.7 90 TEST 582.5 VSS 90 282.1 1380 (1) ...

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Philips Semiconductors I-CODE1 Label IC 12.2 Wafer specifications For further information, please refer to the Philips documents: “Dicing process for thin wafers” and “General specification for 6” wafer” case of doubt or inconsistency the mentioned wafer specifications are ...

Page 13

Philips Semiconductors I-CODE1 Label IC handbook, full pagewidth 13.41 Dimensions in mm. 2002 May 23 13.14 Fig.4 Cluster plan. 13 Product specification SL1ICS3001 MGW342 ...

Page 14

Philips Semiconductors I-CODE1 Label IC handbook, full pagewidth Dimensions in mm. The three black areas show the position of the Process Control Module (PCM) structures on the 6 inch wafer. 2002 May 23 Fig.5 Cluster map. 14 Product specification SL1ICS3001 ...

Page 15

Philips Semiconductors I-CODE1 Label IC 13 APPLICATION INFORMATION 13.1 Protection against visible light As a result of the ultra low power design of the SL1ICS3001 some analog circuits on the chip are light sensitive. This means that common sunlight can ...

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Philips Semiconductors I-CODE1 Label IC 14 DELIVERY 14.1 Configuration of delivered ICs The SL1ICS3001 is delivered with the following configuration by Philips: Serial number is unique and read only Write access conditions allow to change all blocks (with the exception ...

Page 17

Philips Semiconductors I-CODE1 Label IC 2002 May 23 Fig.6 Screen shot of wafer map. 17 Product specification SL1ICS3001 MGW359 ...

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Philips Semiconductors I-CODE1 Label IC Table 8 Map file of this example ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE COPYRIGHT ASCEND LOT 09397 DEVICE VCOL1HE2 PRODUCT VCOL\4020 WAFER 05 READER 09397-05-B6 XSTEP 575 YSTEP 587 XREF 16891 YREF -261 XDELTA ...

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Philips Semiconductors I-CODE1 Label IC 16 DATA SHEET STATUS DATA SHEET PRODUCT (1) STATUS STATUS Objective data Development Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. ...

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Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited ...

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