PIC18F6527-I/PT Microchip Technology, PIC18F6527-I/PT Datasheet - Page 426

• Manufacturer Part Number: PIC18F6527-I/PT
• Description: IC PIC MCU FLASH 24KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F6527-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 48KB (24K x 16)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
• Number Of I /o: 54
• Eeprom Size: 1K x 8
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 3936 B
• Interface Type: SPI/I2C/EUSART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 54
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12-ch x 10-bit
• Package: 64TQFP
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC18F8722 FAMILY
30.2
The following sections give the technical details of the
packages.
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39646B-page 424
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-026
Drawing No. C04-085
Package Details
B
c
*Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .010" (0.254mm) per side.
β
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
(F)
n
p
E
D
B
α
A
φ
c
β
L
L
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
Preliminary
0
5
5
D1
φ
CH x 45°
INCHES
D
NOM
64
.020
.043
.006
.024
.472
.472
.394
.394
.007
.035
.039
.039
.009
A1
3.5
16
10
10
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.041
.011
.045
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0.64
5
5
0
MILLIMETERS*
 2004 Microchip Technology Inc.
NOM
64
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
1.00
0.18
0.22
0.89
3.5
16
10
10
A2
MAX
α
12.25
12.25
10.10
10.10
1.20
1.05
0.25
0.75
0.23
0.27
1.14
15
15
7