MPC8313E-RDB Freescale Semiconductor, MPC8313E-RDB Datasheet - Page 11

• Manufacturer Part Number: MPC8313E-RDB
• Description: BOARD PROCESSOR
• Manufacturer: Freescale Semiconductor
• Series: PowerQUICC II™ PROr
• Type: MCUr

Specifications of MPC8313E-RDB

• Contents: Reference Design Board, Software and Documentation
• Termination Type: SMD
• Supply Voltage Max: 1.05V
• Tool / Board Applications: Wired Connectivity-LIN, CAN, Ethernet, USB
• Mcu Supported Families: POWERQUICC II PRO
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Silicon Manufacturer: Freescale
• Silicon Core Number: MPC83xx
• Kit Application Type: Communication & Networking
• Application Sub Type: Ethernet
• Core Architecture: Power Architecture
• Silicon Family Name: PowerQUICC II PRO
• For Use With/related Products: MPC8313E
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 5
consume the amount of power described.
Table 6
D3 warm low-power state.
Freescale Semiconductor
DDR 1, 60% utilization,
50% read/write
R
R
single pair of clock
capacitive load: data = 8 pF,
control address = 8 pF,
clock = 8 pF
DDR 2, 60% utilization,
50% read/write
R
R
single pair of clock
capacitive load: data = 8 pF,
control address = 8 pF,
clock = 8 pF
PCI I/O load = 50 pF
Local bus I/O load = 20 pF
TSEC I/O load = 20 pF
USBDR controller load = 20 pF
Other I/O
1
s
t
s
t
= 50 Ω
= 75 Ω
= 22 Ω
= 22 Ω
describes a typical scenario where blocks with the stated percentage of utilization and impedances
shows the estimated core power dissipation of the MPC8313E while transitioning into the
Interface
1
2
3
MPC8313E PowerQUICC
All interfaces are enabled. For further power savings, disable the clocks to unused
blocks.
The interfaces are run at the following frequencies: DDR: 333 MHz, eLBC 83 MHz,
PCI 33 MHz, eTSEC1 and TSEC2: 167 MHz, SEC: 167 MHz, USB: 167 MHz. See
the SCCR register for more information.
This is maximum power in D3 Warm based on a voltage of 1.05 V and a junction
temperature of 105°C.
333-MHz Core, 167-MHz CSB
Table 6. MPC8313E Low-Power Modes Power Dissipation
Table 5. MPC8313E Typical I/O Power Dissipation
Parameter
333 MHz,
266 MHz,
333 MHz,
266 MHz,
125 MHz
D3 warm
33 MHz
66 MHz
66 MHz
50 MHz
25 MHz
60 MHz
RGMII,
32 bits
32 bits
32 bits
32 bits
MII,
—
(1.8 V)
GV
0.266
0.246
™
—
—
—
—
—
—
—
—
—
—
II Pro Processor Hardware Specifications, Rev. 3
DD
2
(2.5 V)
GV
0.355
0.323
—
—
—
—
—
—
—
—
—
—
DD
Rev. 1.0
400
(3.3 V)
NV
0.120
0.249
0.015
—
—
—
—
—
—
—
—
—
DD
3
LV
(3.3 V)
LV
0.008
0.078
0.078
—
—
—
—
—
—
—
—
—
DDA
DDB
Rev. 2.x or
/
Later
425
LV
(2.5 V)
LV
0.044
3
—
—
—
—
—
—
—
—
—
—
—
DDA
DDB
/
1
(3.3 V)
0.056
0.040
LV
Unit
mW
—
—
—
—
—
—
—
—
—
—
DD
Power Characteristics
Unit
W
W
W
W
W
W
W
W
W
W
W
W
Comments
Multiple by
number of
interface
used
—
—
—
—
—
—
—
—
—
—
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