STEVAL-IFS006V1 STMicroelectronics, STEVAL-IFS006V1 Datasheet - Page 105

• Manufacturer Part Number: STEVAL-IFS006V1
• Description: BOARD EVAL 8BIT MICRO + TDE1708
• Manufacturer: STMicroelectronics

Specifications of STEVAL-IFS006V1

• Design Resources: STEVAL-IFS006V1 Bill of Material
• Sensor Type: Proximity
• Interface: I²C
• Voltage - Supply: 6 V ~ 48 V
• Embedded: Yes, MCU, 8-Bit
• Utilized Ic / Part: ST7FLITEUS5, TDE1708
• Processor To Be Evaluated: ST7LITEUS5
• Data Bus Width: 8 bit
• Operating Supply Voltage: 6 V to 48 V
• Silicon Manufacturer: ST Micro
• Silicon Core Number: TDE1708DFT
• Kit Application Type: Sensing - Touch / Proximity
• Application Sub Type: Proximity Switch
• Kit Contents: Board
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Sensitivity: -
• Sensing Range: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6403; STEVAL-IFS006V1

ST7LITEUS2, ST7LITEUS5
12.7
12.7.1
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electromagnetic susceptibility)
Based on a simple running application on the product (toggling 2 LEDs through I/O ports),
the product is stressed by two electromagnetic events until a failure occurs (indicated by the
LEDs).
●
●
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
●
●
●
Pre-qualification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see application note AN1015).
Table 59.
Symbol
V
V
FESD
FFTB
ESD: Electrostatic discharge (positive and negative) is applied on all pins of the device
until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to V
V
conforms with the IEC 1000-4-4 standard.
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
SS
through a 100 pF capacitor, until a functional disturbance occurs. This test
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Fast transient voltage burst limits to be
applied through 100 pF on V
pins to induce a functional disturbance
EMC characteristics
Parameter
DD
and V
DD
V
SO8 package,
conforms to IEC 1000-4-2
V
SO8 package,
conforms to IEC 1000-4-4
DD
DD
=5 V, T
=5 V, T
A
A
=+25 °C, f
=+25 °C, f
Conditions
Electrical characteristics
OSC
OSC
=8 MHz,
=8 MHz,
DD
105/136
and
Level/
class
3B
4B