MXHV9910BTR IXYS, MXHV9910BTR Datasheet - Page 98

• Manufacturer Part Number: MXHV9910BTR
• Description: IC LED DRIVER HIGH BRIGHT 8-SOIC
• Manufacturer: IXYS
• Type: HBLED Driverr

Specifications of MXHV9910BTR

• Topology: AC DC Offline Switcher, PWM, Step-Down (Buck)
• Number Of Outputs: 1
• Internal Driver: No
• Type - Primary: Backlight
• Type - Secondary: High Brightness LED (HBLED), RGB
• Frequency: 64kHz
• Voltage - Supply: 8 V ~ 450 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature: -40°C ~ 85°C
• Internal Switch(s): No
• Efficiency: 90%
• Operating Supply Voltage: 7.2 V to 8.4 V
• Maximum Power Dissipation: 2.5 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Current - Output / Channel: -

ISOPLUS-DIL™
High Current low R
New DCB based surface mount package for automotive applications
In the automotive industry the usage of electronics is growing each year, especially with MOSFET technology. Stee-
ring aids, valve control, active suspension and many other functions in a car are driven by MOSFETs. The trends in
these applications are the usage of Trench MOSFET and miniaturization of the electronic components, which results
in low inductance designs with low EMC disturbance, easy manufacturability and the most important one, reliability.
IXYS has introduced the new GWM product series exactly for these applications fulfilling these market demands.
The standard GWM ISOPLUS-DIL™ (Dual-ln-Line) package includes a Trench MOSFET Six-Pack, also customized
configurations can be integrated.
The ISOPLUS-DIL™ package is a new member of the IXYS ISOPLUS family. The IXYS ISOPLUS family is well
known for its advantages: the expansion coefficient of the DCB is close to that of silicon which results in high tempe-
rature cycle reliability, the heat transfer through the ceramic is optimal, if the GWM is compared with standard solu-
tions the current loops are reduced and also the parasitic capacity is reduced. Both results in better EMI behavior of
the application. The advantages of the Direct Copper Bonded substrate results in a very reliable, high power density
component. The GWM, targeted for the automotive segment, will be qualified according to the AEC-Q101.
The GWM ISOPLUS-DIL™ Six-Pack is a very compact and reliable solution for automotive applications, which
contains the latest technology of Trench MOSFET’s. With the electrical and mechanical properties of the GWM
ISOPLUS-DIL™, design-in and usability is improved compared to solutions currently used.
In GMM 3x-series the Six-Pack is split up in 3 electrically isolated and identical phase legs. The advantage is a lower
stray inductance with a superior performance at very high frequencies used for SMPS topologies.
IPC 75PX330GD makes use of the same internal construction as GMM 3x-series but it is built with very fast switching
300 V IGBTs.
Features
• Low R
• Optimized intrinsic reverse diode
• High level of integration
• Multi chip packaging
• High power density
• High current power terminals (300 A, RMS)
• Auxiliary terminals for MOSFET control
• Terminals for soldering (wave or re-flow)
• Isolated DCB ceramic base plate
• 1000 V electrical isolation
• Logic level version feasible
76
or welding connections
with optimized heat transfer
DSon
DS(on)
Trench MOSFET Six-Pack
Applications
• Automobile electric power steering
• Active suspension
• Water pump
• Automobile starter generator
• Propulsion drives
• Fork lift drives
• Battery operated equipment
Benefits
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•
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Highest reliability
Easy assembly
Optimized EMI behavior
Extremely low power loss
Less weight