MXHV9910BTR IXYS, MXHV9910BTR Datasheet - Page 79

no-image

MXHV9910BTR

Manufacturer Part Number
MXHV9910BTR
Description
IC LED DRIVER HIGH BRIGHT 8-SOIC
Manufacturer
IXYS
Type
HBLED Driverr
Datasheets

Specifications of MXHV9910BTR

Topology
AC DC Offline Switcher, PWM, Step-Down (Buck)
Number Of Outputs
1
Internal Driver
No
Type - Primary
Backlight
Type - Secondary
High Brightness LED (HBLED), RGB
Frequency
64kHz
Voltage - Supply
8 V ~ 450 V
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Operating Temperature
-40°C ~ 85°C
Internal Switch(s)
No
Efficiency
90%
Operating Supply Voltage
7.2 V to 8.4 V
Maximum Power Dissipation
2.5 W
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Output
-
Current - Output / Channel
-
MXEI2300
300 Output E Ink Gate Driver
Features
• CMOS Technology
• Drives Segment or Active Matrix Displays
• 16 to 47 Volt Output Drive
• Selectable Output Shift Direction and Polarity
• 3 Output Switching Modes
• Cascadable (4 Maximum)
Ordering Information
Block Diagram
MODE1
MODE2
WALK0
TEST1
Part No.
MXEI2300WB
MXEI2300XB
SPV
CKV
CE1
CE2
R/L
controller
diodes
Description
Gold Bumped Die / Wafer Form
Gold Bumped Die / Waffle Pack
ESD
generator
V
BIAS
Vdd
Vee
LS/amp
buffer/
driver
OG1
bit1
Shift register/pulse generator
Vdd
Vee
LS/amp
buffer/
driver
OG2
bit2
...
...
...
Vdd
Vee
LS/amp
buffer/
driver
OG300
bit300
General Description
The MXEI2300 is a 300 bit serial shift register, level translator,
and high voltage buffered driver. The shift register is ‘seeded’
by the CE1, CE2, R/L, SPV, and CKV inputs.
The output pulse pattern is selected with the MODE1 and
MODE2 inputs. A one pulse, continuous two pulse, jumping two
pulse, or no pulse pattern can be generated. Pulse polarity is
selected with the WALK0 input.
The register output bits are amplified rail-rail from V
the output strength of the buffer drivers is modulated by the
Vbias generator. This allows the OGn outputs to be continuously
optimized for peak performance while minimizing transients
over a wide operating range.
The MXEI2300 is designed to operate over a temperature range
of -40°C to +85°C, and is available as Gold Bumped Die in
Waffle Pack, Gold Bumped Die in Wafer Form, Tape Carrier
Package, and BGA Package.
EE
to V
DD
, and
57

Related parts for MXHV9910BTR