MXHV9910BTR IXYS, MXHV9910BTR Datasheet - Page 53

• Manufacturer Part Number: MXHV9910BTR
• Description: IC LED DRIVER HIGH BRIGHT 8-SOIC
• Manufacturer: IXYS
• Type: HBLED Driverr

Specifications of MXHV9910BTR

• Topology: AC DC Offline Switcher, PWM, Step-Down (Buck)
• Number Of Outputs: 1
• Internal Driver: No
• Type - Primary: Backlight
• Type - Secondary: High Brightness LED (HBLED), RGB
• Frequency: 64kHz
• Voltage - Supply: 8 V ~ 450 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature: -40°C ~ 85°C
• Internal Switch(s): No
• Efficiency: 90%
• Operating Supply Voltage: 7.2 V to 8.4 V
• Maximum Power Dissipation: 2.5 W
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Current - Output / Channel: -

Analog & Mixed Signal ASIC Capabilities
Since our founding in 1983, Micronix has supplied hundreds of
high performance mixed analog-digital integrated circuits for
the commercial, industrial and military markets.
Using our own Intellectual Property (IP) combined with third
party IP, we can work with you to develop an ASSP that meets
the needs of your particular industry or we can perform a
complete turnkey solution of a high volume, proprietary mixed-
signal ASIC specifically for your product.
As a subsidiary of IXYS, we have access to an in-house High
Voltage Silicon On Insulator foundry and multi-chip module
assembly line. Additionally, we have developed strategic
alliances with other select, highly capitalized wafer foundries
Mixed Signal Design Flow
• Turnkey:
• Collaborative:
General Performance Parameters
• Supply Voltages from 0.5 V to 550 V
• Operating Frequencies from DC to 150MHz
Foundry Partners
• US: AMI, X-Fab
• Europe: AMI, X-Fab, Zarlink
• Asia: Dongbu, Samsung, UMC
Process Technologies
• CMOS Mixed Signal w/High Voltage
• Bipolar
• BiCMOS
• SOI BCDMOS High Voltage
Micronix develops and manufactures a device that meets
Your digital design is incorporated via VHDL (or other high
your product specifications.
level language) or GDSII with Micronix analog functions to
develop and manufacture a device that meets your product
specifications.
and assembly houses. This unique capability enables us to
apply the optimum mix of circuit topology and process to each
application.
Experience has taught us that the most successful programs are
those in which our customer’s engineering staff play a major role
in defining the circuit requirements. This close working relations-
hip maximizes the benefits derived from a custom integrated
circuit.
We believe that in today’s complex business and technical
relationships, trust and loyalty are as relevant as they ever have
been. These simple virtues have provided the foundation of our
growth, and we are committed to bringing them into each new
business relationship.
Packaging
• Through-Hole
• Surface Mount
• Multi-Chip Module
• TCP/COF (Tape Carrier Packaging, Chip On Flex)
• Tested Die (option = bumped)
• Tape & Reel
Screening
• Mil-Std-883 Class B
• Custom
Quality
• Mil-I-45208 Certified
• ISO 9001:2000 Certified
DIP, PGA
BGA
CLCC, PLCC
QFN, QFP
SOIC
70mm
Super 48mm
Super 35mm
Waffle Pack
Wafer (Inked or wafer map)
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