CY7C1460AV25-200BZC Cypress Semiconductor Corp, CY7C1460AV25-200BZC Datasheet - Page 18

• Manufacturer Part Number: CY7C1460AV25-200BZC
• Description: IC SRAM 36MBIT 200MHZ 165LFBGA
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1460AV25-200BZC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 36M (1M x 36)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 165-LFBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Document #: 38-05354 Rev. *D
AC Test Loads and Waveforms
Note:
Capacitance
Thermal Resistance
16. Tested initially and after any design or process change that may affect these parameters.
C
C
C
Θ
Θ
Parameters
Parameter
IN
CLK
I/O
JA
JC
OUTPUT
OUTPUT
3.3V I/O Test Load
2.5V I/O Test Load
Input Capacitance
Clock Input Capacitance
Input/Output Capacitance
[16]
Z
Z
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Case)
0
0
= 50Ω
= 50Ω
Description
Description
(a)
(a)
V
V
[16]
T
T
= 1.25V
= 1.5V
R
R
L
L
= 50Ω
= 50Ω
OUTPUT
OUTPUT
3.3V
2.5V
Test conditions follow standard
test methods and procedures
for measuring thermal
impedance, per EIA/JESD51.
INCLUDING
INCLUDING
JIG AND
JIG AND
SCOPE
SCOPE
V
T
DD
A
Test Conditions
Test Conditions
5 pF
5 pF
= 25°C, f = 1 MHz,
= 2.5V V
(b)
(b)
DDQ
R = 317Ω
R = 1667Ω
= 2.5V
R = 351Ω
R = 1538Ω
100 TQFP
100 TQFP
Package
V
Max.
25.21
GND
GND
V
2.58
DDQ
6.5
5.5
DDQ
3
≤ 1ns
≤ 1ns
10%
10%
165 FBGA
165 FBGA
Package
ALL INPUT PULSES
ALL INPUT PULSES
Max.
20.8
3.2
7
7
6
90%
90%
CY7C1460AV25
CY7C1462AV25
CY7C1464AV25
(c)
(c)
209 FBGA
209 FBGA
Package
25.31
4.48
Max.
5
5
7
Page 18 of 27
90%
90%
10%
10%
≤ 1ns
≤ 1ns
°C/W
°C/W
Unit
Unit
pF
pF
pF
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