CY7C1460AV25-200BZC Cypress Semiconductor Corp, CY7C1460AV25-200BZC Datasheet - Page 14

• Manufacturer Part Number: CY7C1460AV25-200BZC
• Description: IC SRAM 36MBIT 200MHZ 165LFBGA
• Manufacturer: Cypress Semiconductor Corp

Specifications of CY7C1460AV25-200BZC

• Format - Memory: RAM
• Memory Type: SRAM - Synchronous
• Memory Size: 36M (1M x 36)
• Speed: 200MHz
• Interface: Parallel
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 165-LFBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Document #: 38-05354 Rev. *D
Scan Register Sizes
Identification Codes
Instruction
Bypass
ID
Boundary Scan Order (165-ball FBGA package)
Boundary Scan Order (209-ball FBGA package)
EXTEST
IDCODE
SAMPLE Z
RESERVED
SAMPLE/PRELOAD
RESERVED
RESERVED
BYPASS
Instruction
Register Name
Code
000
001
010
100
101
011
110
111
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM outputs to High-Z state.
Loads the ID register with the vendor ID code and places the register between TDI and
TDO. This operation does not affect SRAM operations.
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Forces all SRAM output drivers to a High-Z state.
Do Not Use: This instruction is reserved for future use.
Captures I/O ring contents. Places the boundary scan register between TDI and TDO.
Does not affect SRAM operation.
Do Not Use: This instruction is reserved for future use.
Do Not Use: This instruction is reserved for future use.
Places the bypass register between TDI and TDO. This operation does not affect SRAM
operations.
Bit Size (x36)
89
32
3
1
–
Description
Bit Size (x18)
32
89
3
1
–
CY7C1460AV25
CY7C1462AV25
CY7C1464AV25
Bit Size (x72)
Page 14 of 27
138
32
3
1
–
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