S9S08SG8E2VTJR Freescale Semiconductor, S9S08SG8E2VTJR Datasheet - Page 25

• Manufacturer Part Number: S9S08SG8E2VTJR
• Description: 8-bit Microcontrollers - MCU 9S08 UC W/ 8K 0.25UM SGF
• Manufacturer: Freescale Semiconductor

Specifications of S9S08SG8E2VTJR

• Rohs: yes
• Core: HCS08
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 40 MHz
• Program Memory Size: 8 KB
• Data Ram Size: 512 B
• On-chip Adc: Yes
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: TSSOP-20
• Mounting Style: SMD/SMT
• A/d Bit Size: 10 bit
• A/d Channels Available: 12
• Interface Type: I2C, SCI, SPI
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Number Of Programmable I/os: 16
• Number Of Timers: 3
• Program Memory Type: Flash
• Supply Voltage - Max: 5.5 V
• Supply Voltage - Min: 2.7 V

Section Number
17.3 On-Chip Debug System (DBG) .................................................................................................... 279
17.4 Register Definition ........................................................................................................................ 283
A.1 Introduction ....................................................................................................................................291
A.2 Parameter Classification.................................................................................................................291
A.3 Absolute Maximum Ratings...........................................................................................................291
A.4 Thermal Characteristics..................................................................................................................293
A.5 ESD Protection and Latch-Up Immunity .......................................................................................295
A.6 DC Characteristics..........................................................................................................................296
A.7 Supply Current Characteristics.......................................................................................................302
A.8 External Oscillator (XOSC) Characteristics ..................................................................................306
A.9 Internal Clock Source (ICS) Characteristics ..................................................................................308
A.10 Analog Comparator (ACMP) Electricals .......................................................................................309
A.11 ADC Characteristics.......................................................................................................................310
A.12 AC Characteristics..........................................................................................................................316
A.13 Flash Specifications........................................................................................................................323
A.14 EMC Performance..........................................................................................................................324
B.1 Ordering Information .....................................................................................................................325
B.2 Package Information and Mechanical Drawings ...........................................................................326
Freescale Semiconductor
17.3.1 Comparators A and B...................................................................................................... 279
17.3.2 Bus Capture Information and FIFO Operation ............................................................... 279
17.3.3 Change-of-Flow Information .......................................................................................... 280
17.3.4 Tag vs. Force Breakpoints and Triggers ......................................................................... 280
17.3.5 Trigger Modes................................................................................................................. 281
17.3.6 Hardware Breakpoints .................................................................................................... 283
17.4.1 BDC Registers and Control Bits ..................................................................................... 283
17.4.2 System Background Debug Force Reset Register (SBDFR) .......................................... 285
17.4.3 DBG Registers and Control Bits..................................................................................... 286
A.12.1 Control Timing ................................................................................................................316
A.12.2 TPM/MTIM Module Timing ...........................................................................................318
A.12.3 SPI....................................................................................................................................319
A.14.1 Radiated Emissions..........................................................................................................324
B.1.1 Device Numbering Scheme .............................................................................................326
Ordering Information and Mechanical Drawings
Electrical Characteristics
MC9S08SG32 Data Sheet, Rev. 8
Appendix A
Appendix B
Title
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