W25Q16BVSSIG Winbond Electronics, W25Q16BVSSIG Datasheet - Page 8

• Manufacturer Part Number: W25Q16BVSSIG
• Description: IC SPI FLASH 16MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

7. PIN CONFIGURATION SOIC 300-MIL
8. PIN DESCRIPTION SOIC 300-MIL
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
PAD NO.
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
9
PAD NAME
/HOLD (IO3)
/WP (IO2)
DO (IO1)
DI (IO0)
Figure 1d. W25Q16BV Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)
GND
VCC
CLK
/HOLD (IO
/HOLD (IO
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
/CS
DO (IO )
DO (IO )
VCC
VCC
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
/CS
/CS
3
3
1
1
)
)
I/O
I/O
I/O
I/O
I/O
I
I
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
Hold Input (Data Input Output 3)*
Power Supply
No Connect
No Connect
No Connect
No Connect
Chip Select Input
Data Output (Data Input Output 1)*
Write Protect Input (Data Input Output 2)*
Ground
No Connect
No Connect
No Connect
No Connect
Data Input (Data Input Output 0)*
Serial Clock Input
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16
16
15
15
14
14
13
13
12
12
11
11
10
10
9
9
FUNCTION
CLK
CLK
DI (IO
DI (IO
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
GND
GND
/WP (IO )
/WP (IO )
0
0
2
1
)
)
2
2
1
2
W25Q16BV