W25Q16BVSSIG Winbond Electronics, W25Q16BVSSIG Datasheet - Page 37

IC SPI FLASH 16MBIT 8SOIC

W25Q16BVSSIG

Manufacturer Part Number
W25Q16BVSSIG
Description
IC SPI FLASH 16MBIT 8SOIC
Manufacturer
Winbond Electronics
Datasheet

Specifications of W25Q16BVSSIG

Format - Memory
FLASH
Memory Type
FLASH
Memory Size
16M (2M x 8)
Speed
104MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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W25Q16BV
11.2.18 Quad Input Page Program (32h)
The Quad Page Program instruction allows up to 256 bytes of data to be programmed at previously
erased (FFh) memory locations using four pins: IO
, IO
, IO
, and IO
. The Quad Page Program can
0
1
2
3
improve performance for PROM Programmer and applications that have slow clock speeds <5MHz.
Systems with faster clock speed will not realize much benefit for the Quad Page Program instruction
since the inherent page program time is much greater than the time it take to clock-in the data.
To use Quad Page Program the Quad Enable in Status Register-2 must be set (QE=1). A Write Enable
instruction must be executed before the device will accept the Quad Page Program instruction (Status
Register-1, WEL=1). The instruction is initiated by driving the /CS pin low then shifting the instruction
code “32h” followed by a 24-bit address (A23-A0) and at least one data byte, into the IO pins. The /CS pin
must be held low for the entire length of the instruction while data is being sent to the device. All other
functions of Quad Page Program are identical to standard Page Program. The Quad Page Program
instruction sequence is shown in figure 17.
Figure 17. Quad Input Page Program Instruction Sequence Diagram
Publication Release Date: July 08, 2010
- 37 -
Revision F

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