W25Q16BVSSIG Winbond Electronics, W25Q16BVSSIG Datasheet - Page 61

• Manufacturer Part Number: W25Q16BVSSIG
• Description: IC SPI FLASH 16MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

13.2 8-Pin SOIC 208-mil (Package Code SS)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D1 and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
SYMBOL
A1
A2
D1
E1
e
A
C
D
E
H
b
L
θ
y
(2)
Min
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
---
0°
MILLIMETERS
1.27 BSC.
Nom
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
7.90
0.65
---
---
Max
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.10
- 61 -
8°
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
Min
---
0°
0.050 BSC.
INCHES
Publication Release Date: July 08, 2010
Nom
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.311
0.026
---
---
Max
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
8°
W25Q16BV
GAUGE PLANE
GAUGE PLANE
Revision F