W25Q16BVSSIG Winbond Electronics, W25Q16BVSSIG Datasheet - Page 6

• Manufacturer Part Number: W25Q16BVSSIG
• Description: IC SPI FLASH 16MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (5.3mm Width), 8-SOP, 8-SOEIAJ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

4. PAD CONFIGURATION WSON 6X5-MM
3. PIN CONFIGURATION SOIC 150 / 208-MIL
/WP (IO
/WP (IO
DO (IO
DO (IO
Figure 1a. W25Q16BV Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS)
GND
GND
Figure 1b. W25Q16BV Pad Assignments, 8-pad WSON 6x5-mm(Package Code ZP)
/CS
/CS
1
1
2
2
)
)
)
)
/WP (IO
/WP (IO
DO (IO
DO (IO
GND
GND
/CS
/CS
1
1
2
2
)
)
)
)
1
1
2
2
3
3
4
4
1
1
2
2
3
3
4
4
- 6 -
8
8
7
7
6
6
5
5
8
8
7
7
6
6
5
5
VCC
VCC
/HOLD (IO
/HOLD (IO
CLK
CLK
DI (IO
DI (IO
0
0
)
)
3
3
VCC
VCC
/HOLD (IO
/HOLD (IO
CLK
CLK
DI (IO
DI (IO
)
)
0
0
)
)
W25Q16BV
3
3
)
)