CYIL1SM1300AA_09 CYPRESS [Cypress Semiconductor], CYIL1SM1300AA_09 Datasheet - Page 25

• Manufacturer Part Number: CYIL1SM1300AA_09
• Description: LUPA-1300 1.3 MPxl High Speed CMOS Image Sensor
• Manufacturer: CYPRESS [Cypress Semiconductor]

Color
For color devices a near infrared attenuating color filter glass is
used. The dominant wavelength is around 490 nm.
shows the transmittance curve for the glass.
Handling and Storage Precautions
Handling Precautions
Special care should be given when soldering image sensors with
color filter arrays (RGB color filters), onto a circuit board, since
color filters are sensitive to high temperatures. Prolonged
heating at elevated temperatures may result in deterioration of
the performance of the sensor. The following recommendations
are made to ensure that sensor performance is not compromised
during end-users' assembly processes.
Board Assembly
Device placement onto boards should be done in accordance
with strict ESD controls for Class 0, JESD22 Human Body Model,
and Class A, JESD22 Machine Model devices. Assembly
operators should always wear all designated and approved
grounding equipment; grounded wrist straps at ESD protected
workstations are recommended including the use of ionized
blowers. All tools should be ESD protected.
Document Number: 38-05711 Rev. *D
Figure 23. Transmission Characteristics of S8612 Glass Used as NIR Cut-Off Filter
Figure 23
A S8612 glass will be used as NIR cut-off filter on top of the
LUPA-1300-C color image sensor.
mission characteristics of the S8612 glass.
Manual Soldering
When a soldering iron is used the following conditions should be
observed:
■
■
■
Precautions and Cleaning
Avoid spilling solder flux on the cover glass; bare glass and
particularly glass with antireflection filters may be adversely
affected by the flux. Avoid mechanical or particulate damage to
the cover glass.
It is recommended that isopropyl alcohol (IPA) be used as a
solvent for cleaning the image sensor glass lid. When using other
solvents, it should be confirmed beforehand whether the solvent
will dissolve the package and/or the glass lid or not.
Use a soldering iron with temperature control at the tip.
The soldering iron tip temperature should not exceed 350°C.
The soldering period for each pin should be less than 5
seconds.
CYIL1SM1300AA
Figure 24
shows the trans-
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