CYIL1SM1300AA_09 CYPRESS [Cypress Semiconductor], CYIL1SM1300AA_09 Datasheet - Page 10

• Manufacturer Part Number: CYIL1SM1300AA_09
• Description: LUPA-1300 1.3 MPxl High Speed CMOS Image Sensor
• Manufacturer: CYPRESS [Cypress Semiconductor]

The control of the readout of the frame and of the integration time are independent of each other with the only exception that the end
of the integration time from frame I+1 is the beginning of the readout of frame I+1.
Non-Destructive Readout (NDR)
The sensor can also be read out in a non-destructive way. After a pixel is initially reset, it can be read multiple times, without resetting.
The initial reset level and all intermediate signals can be recorded. High light levels will saturate the pixels quickly, but a useful signal
is obtained from the early samples. For low light levels, one has to use the later or latest samples.
Essentially an active pixel array is read multiple times, and reset
only once. The external system intelligence takes care of the
interpretation of the data.
and disadvantages of non-destructive readout.
Table 6. Advantages and Disadvantages of Non-Destructive
Readout
Document Number: 38-05711 Rev. *D
Low noise – as it is true CDS. System memory required to
High sensitivity – as the
conversion capacitance is kept
rather low.
High dynamic range – as the
results include signal for short
and long integrations times.
Note
9. Normal application does not require this Gnd_res and it can be connected to ground.
Advantages
Table 6
record the reset level and the
intermediate samples.
Requires multiples readings of
each pixel, thus higher data
throughput.
Requires system level digital
calculations.
summarizes the advantages
Read frame I
Integration I + 1
Figure 10. Principle of Non-Destructive Readout
Disadvantages
Figure 9. Integration and Readout in Parallel
Operation and Signaling
One can distinguish the different signals into different groups:
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Power Supplies and Grounds
Every module on chip, as there are: column readout, output
stages, digital modules, drivers, has its own power supply and
ground. Off chip the grounds can be combined, but not all power
supplies may be combined. This results in several power
supplies, but is required to reduce electrical crosstalk and to
improve shielding.
On chip we have the ground lines also separately for every
module to improve shielding and electrical crosstalk between
them. The only special ground is "Gnd_res", which can be used
to remove the blooming if any and which can improve optical
crosstalk.
An overview of the supplies is given in
supplies related to the pixel array signals are described in the
paragraph concerning the pixel array signals.
Power supplies and grounds
Biasing and analog signals
Pixel array signals
Digital signals
Test signals
Read frame I + 1
Integration I + 2
time
CYIL1SM1300AA
Table
7. The power
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